Patents by Inventor Kenji Kamoda

Kenji Kamoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLATING APPARATUS AND PLATING METHOD
    Publication number: 20130015075
    Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Inventors: Masahiko SEKIMOTO, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami, Kenji Kamoda
  • PLATING APPARATUS AND PLATING METHOD
    Publication number: 20090301395
    Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
    Type: Application
    Filed: August 19, 2009
    Publication date: December 10, 2009
    Inventors: Masahiko SEKIMOTO, Yasuhiko Endo, Stephen Strausser, Takashi Takemura, Nobutoshi Saito, Fumio Kuriyama, Junichiro Yoshioka, Kuniaki Horie, Yoshio Minami, Kenji Kamoda
  • Positive displacement type liquid-delivery apparatus
    Patent number: 6419462
    Abstract: A positive displacement liquid-delivery apparatus includes a positive displacement pump 110 and a differential pressure control unit 142. The positive displacement pump 110 includes a liquid-delivery chamber 128 having a watertight housing 122 with one part formed of a flexible diaphragm 124, and a diaphragm driver 136 linked to the diaphragm 124 for deforming the same to discharge fluid from the liquid-delivery chamber 128. The differential pressure control unit 142 uniformly controls the differential pressure inside and outside the diaphragm 124 during the pumping process.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: July 16, 2002
    Assignee: Ebara Corporation
    Inventors: Kuniaki Horie, Yukio Fukunaga, Akihisa Hongo, Kiwamu Tsukamoto, Kenji Kamoda, Hirotake Yamagishi, Shinya Uemura