Patents by Inventor Kenji Kanazawa
Kenji Kanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240079687Abstract: Provided are a power generation method and a power generating element capable of obtaining an electromotive force by utilizing humidity variation in an environment and having excellent operation stability. An aqueous solution of an ionic compound having deliquescence is separated by an ion permeable membrane, electrodes are inserted into the aqueous solution on both sides of the ion permeable membrane, one is blocked from outside air and sealed, and the other is connected to the outside air, and a difference in ion concentration derived from the ionic compound in the aqueous solution is generated across the ion permeable membrane due to a change in humidity in the outside air to generate an electromotive force between the electrodes.Type: ApplicationFiled: October 13, 2021Publication date: March 7, 2024Applicant: National Institute of Advanced Industrial Science and TechnologyInventors: Yusuke Komazaki, Kenji Kanazawa, Taiki Nobeshima, Hirotada Hirama, Yuichi Watanabe, Sei Uemura
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Publication number: 20230112020Abstract: A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.Type: ApplicationFiled: November 18, 2020Publication date: April 13, 2023Applicants: SENJU METAL INDUSTRY CO., LTD., National Institute of Advanced Industrial Science and TechnologyInventors: Haruya SAKUMA, Kenichi TOMITSUKA, Hisahiko YOSHIDA, Kenji KANAZAWA, Sei UEMURA, Takashi NAKAMURA, Masateru NISHIOKA
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Patent number: 11590557Abstract: A wire forming apparatus 1 comprises a rotary table 22 that is rotatably supported by a table body 21, a slide tool unit 100A that is attached to the rotary table 22 and supports a slide tool T1 capable of sliding toward a wire guide, and a tool slide mechanism 60 that is supported by the table body 21 and transmits a driving force for sliding the slide tool T1 to the slide tool unit 100A. The tool slide mechanism 60 has a single motive power transmission member 61 that is rotatably supported by the table body 21, and a driving force generated by a rotation of the motive power transmission member 61 is transmitted, in common, to a plurality of slide tools T1 attached to the rotary table 22.Type: GrantFiled: March 19, 2021Date of Patent: February 28, 2023Assignee: KABUSHIKI KAISHA ITAYA SEISAKU SHOInventors: Kenji Kanazawa, Takashi Ando
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Publication number: 20220402057Abstract: A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.Type: ApplicationFiled: November 18, 2020Publication date: December 22, 2022Applicants: SENJU METAL INDUSTRY CO., LTD., National Institute of Advanced Industrial Science and TechnologyInventors: Haruya SAKUMA, Kenichi TOMITSUKA, Hisahiko YOSHIDA, Kenji KANAZAWA, Sei UEMURA, Takashi NAKAMURA, Masateru NISHIOKA
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Publication number: 20220402058Abstract: A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion; an electronic device mounting board using the mounting wiring board; a method of mounting the electronic device; a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; and a microwave heating apparatus.Type: ApplicationFiled: November 10, 2020Publication date: December 22, 2022Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kenji KANAZAWA, Sei UEMURA, Masateru NISHIOKA, Takashi NAKAMURA
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Publication number: 20210308738Abstract: A wire forming apparatus 1 comprises a rotary table 22 that is rotatably supported by a table body 21, a slide tool unit 100A that is attached to the rotary table 22 and supports a slide tool T1 capable of sliding toward a wire guide, and a tool slide mechanism 60 that is supported by the table body 21 and transmits a driving force for sliding the slide tool T1 to the slide tool unit 100A. The tool slide mechanism 60 has a single motive power transmission member 61 that is rotatably supported by the table body 21, and a driving force generated by a rotation of the motive power transmission member 61 is transmitted, in common, to a plurality of slide tools T1 attached to the rotary table 22.Type: ApplicationFiled: March 19, 2021Publication date: October 7, 2021Applicant: KABUSHIKI KAISHA ITAYA SEISAKU SHOInventors: Kenji KANAZAWA, Takashi ANDO
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Patent number: 9753430Abstract: To detect humidity, used are a first series connection circuit connecting a thermistor and a fixed resistor via a node, a second series connection circuit connecting a resistance change type humidity sensor and the thermistor via the node, and a third series connection circuit connecting the humidity sensor and the fixed resistor via the node. A predetermined voltage is applied across the first circuit to detect a first voltage indicating temperature through the node, and secondly across the second circuit to detect a second voltage indicating a first humidity through the node, and finally across the third circuit to detect a third voltage indicating a second humidity through the node. Then, the first voltage is compared with a reference voltage and judgment is made, based on a comparison result, to determine which of the second voltage and the third voltage is relevant to use as a basis for outputting the humidity as detected.Type: GrantFiled: March 25, 2014Date of Patent: September 5, 2017Assignee: Brother Kogyo Kabushiki KaishaInventors: Jie Zheng, Ryo Ito, Kenji Kanazawa, Osamu Takahashi
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Publication number: 20140283597Abstract: To detect humidity, used are a first series connection circuit connecting a thermistor and a fixed resistor via a node, a second series connection circuit connecting a resistance change type humidity sensor and the thermistor via the node, and a third series connection circuit connecting the humidity sensor and the fixed resistor via the node. A predetermined voltage is applied across the first circuit to detect a first voltage indicating temperature through the node, and secondly across the second circuit to detect a second voltage indicating a first humidity through the node, and finally across the third circuit to detect a third voltage indicating a second humidity through the node. Then, the first voltage is compared with a reference voltage and judgment is made, based on a comparison result, to determine which of the second voltage and the third voltage is relevant to use as a basis for outputting the humidity as detected.Type: ApplicationFiled: March 25, 2014Publication date: September 25, 2014Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventors: Jie Zheng, Ryo Ito, Kenji Kanazawa, Osamu Takahashi
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Patent number: 5481959Abstract: An automatic air balancer system capable of maintaining various kinds of load at a predetermined position and then moving the load at a desired speed, or applying a desired mechanical force to various kinds of object. The system includes a device for controlling the pressure at one end side of a balance cylinder to a desired level by a first pressure control valve and for controlling the pressure at the other end side of the balance cylinder to a predetermined level by a second pressure control valve, and a device for obtaining a balance pressure signal for the balance cylinder. Another signal is added to or subtracted from the balance pressure signal, and the resulting signal is input to the first pressure control valve.Type: GrantFiled: November 30, 1994Date of Patent: January 9, 1996Assignee: SMC CorporationInventors: Masayuki Watanabe, Nobuhiro Fujiwara, Kunihisa Kaneko, Kenji Kanazawa