Abstract: An aircraft fuselage assembling jig is a horizontal-type jig on which an aircraft fuselage panel is placed in a laid-down state, and includes: a base with a plurality of frame indexes for positioning both ends of a plurality of aircraft fuselage frames; a plurality of header plates, each of which protrudes from the base to extend along the panel, the header plates being arranged in parallel in an axial direction of the panel; a plurality of electric cylinders radially provided on each plate, the electric cylinders moving respective receiving members in a radial direction of the panel, the receiving members contacting a skin included in the panel; and air lifting devices provided on the respective receiving members and that, when supplied with air pressure, lift the skin from receiving surfaces of the respective receiving members and support the aircraft fuselage panel such that the aircraft fuselage panel is slidable.

Abstract: An aircraft fuselage assembling jig includes: a base provided with a plurality of frame indexes for positioning both ends of a plurality of aircraft fuselage frames; a plurality of header plates, each of which protrudes from the base so as to extend along an aircraft fuselage panel, the header plates being arranged parallel to each other in an axial direction of the aircraft fuselage panel; and a plurality of electric cylinders radially provided on each of the plurality of header plates, the electric cylinders moving respective receiving members in a radial direction of the aircraft fuselage panel, the receiving members contacting a skin included in the aircraft fuselage panel.

Abstract: An aircraft component assembly jig includes: header plates; positioners provided on each of the header plates, each positioner including a receiver that comes into contact with a lower/upper surface of an aircraft component, each positioner causing the receiver to advance and retract; receiver state detectors, that each detects, as control data, a supporting state of a corresponding one of the receivers; and a circuitry. The circuitry compares each of detection values of the control data with a preset reference value to determine whether an equal support state is achieved, the equal support state being a state where all the receivers are equally supporting the aircraft component. If it is determined that the equal support state is not achieved, the circuitry controls an adjustment-requiring positioner among all the positioners to adjust an advancing/retracting position of the receiver of the adjustment-requiring positioner within a design tolerance.

Abstract: A component mounting system for mounting a component to a frame member by a fastener, and includes: a machining apparatus configured to machine a hole in each of the frame member and the component along a machining axis and fasten the frame member and the component together by the fastener; a positioning unit configured to perform positioning of a mounting position present on the frame member relative to the machining axis; a robot configured to transfer the component to the mounting position present on the frame member; and a detector including a camera and a sensor, the camera being provided on the machining axis and configured to capture an image of the component transferred to the mounting position, the sensor being configured to detect a tilt of the component transferred to the mounting position.

Abstract: Provided is a semiconductor wafer in which a nitride crystal layer on a silicon wafer includes a reaction suppressing layer to suppress reaction between a silicon atom and a Group-III atom, a stress generating layer to generate compressive stress and an active layer in which an electronic element is to be formed, the reaction suppressing layer, the stress generating layer and the active layer are arranged in an order of the reaction suppressing layer, the stress generating layer and the active layer with the reaction suppressing layer being positioned the closest to the silicon wafer, and the stress generating layer includes a first crystal layer having a bulk crystal lattice constant of al and a second crystal layer in contact with a surface of the first crystal layer that faces the active layer, where the second crystal layer has a bulk crystal lattice constant of a2 (a1<a2).

Abstract: A circular scratch inspection apparatus includes: a camera capturing an image of a workpiece surface around a hole; illumination device emitting light to the workpiece surface around the hole, the light being reflected on the workpiece surface is not directly incident on the camera; and image processor. The image processor: generates a second-derivative image by performing secondary differentiation on luminance values in an actual image obtained by the camera; generates a second-derivative curve for each of a plurality of ruler lines, extending radially from the hole center and are set in an inspection target region on the workpiece surface; counts a first reference number of times for each ruler line; calculates a first reference total number of times; and determines presence or absence of a circular scratch by using the first reference total number of times.

Abstract: A drilling apparatus includes: a table supporting a plate; a drill machining a through-hole in the plate; an annular pressing member pressing the plate around the through-hole; a camera capturing a plate surface image through an inner space of the pressing member; and a moving device moving the drill between machining and retraction positions, the machining position being at which the drill center coincides with the pressing member center, the retraction position being a position at which the drill is positioned outside a field of view of the camera. Insertion holes distributed in a circumferential direction are formed in the pressing member, and illumination devices, each emitting light to the plate surface around the through-hole, are inserted in the respective insertion holes. An optical axis direction of each of the illumination devices inserted in the respective insertion holes and the plate surface form an angle of 25 to 60°.

Abstract: A component mounting system for mounting a component to a frame member by a fastener, and includes: a machining apparatus configured to machine a hole in each of the frame member and the component along a machining axis and fasten the frame member and the component together by the fastener; a positioning unit configured to perform positioning of a mounting position present on the frame member relative to the machining axis; a robot configured to transfer the component to the mounting position present on the frame member; and a detector including a camera and a sensor, the camera being provided on the machining axis and configured to capture an image of the component transferred to the mounting position, the sensor being configured to detect a tilt of the component transferred to the mounting position.

Abstract: An aircraft fuselage assembling jig is a horizontal-type jig on which an aircraft fuselage panel is placed in a laid-down state, and includes: a base with a plurality of frame indexes for positioning both ends of a plurality of aircraft fuselage frames; a plurality of header plates, each of which protrudes from the base to extend along the panel, the header plates being arranged in parallel in an axial direction of the panel; a plurality of electric cylinders radially provided on each plate, the electric cylinders moving respective receiving members in a radial direction of the panel, the receiving members contacting a skin included in the panel; and air lifting devices provided on the respective receiving members and that, when supplied with air pressure, lift the skin from receiving surfaces of the respective receiving members and support the aircraft fuselage panel such that the aircraft fuselage panel is slidable.

Abstract: An aircraft fuselage assembling jig includes: a base provided with a plurality of frame indexes for positioning both ends of a plurality of aircraft fuselage frames; a plurality of header plates, each of which protrudes from the base so as to extend along an aircraft fuselage panel, the header plates being arranged parallel to each other in an axial direction of the aircraft fuselage panel; and a plurality of electric cylinders radially provided on each of the plurality of header plates, the electric cylinders moving respective receiving members in a radial direction of the aircraft fuselage panel, the receiving members contacting a skin included in the aircraft fuselage panel.

Abstract: A measurement method for a laminate substrate is provided. The laminate substrate has: a base substrate; an absorption layer; and a measurement-target layer in this order. The measurement-target layer has a single measurement-target monolayer or a plurality of measurement-target monolayers. The method includes: emitting incident light including light with a wavelength shorter than a threshold wavelength from a side on which the measurement-target layer is positioned, and measuring reflected light and acquiring mutually independent 2n (n is a layer count of the measurement-target monolayers included in the measurement-target layer and is an integer equal to one or larger) or more reflected light-related values for wavelengths equal to the threshold wavelength or shorter; and calculating values related to the measurement-target monolayers for each measurement-target monolayer included in the measurement-target layer using the 2n or more reflected light-related values.

Abstract: A drilling apparatus includes: a table supporting a plate; a drill machining a through-hole in the plate; an annular pressing member pressing the plate around the through-hole; a camera capturing a plate surface image through an inner space of the pressing member; and a moving device moving the drill between machining and retraction positions, the machining position being at which the drill center coincides with the pressing member center, the retraction position being a position at which the drill is positioned outside a field of view of the camera. Insertion holes distributed in a circumferential direction are formed in the pressing member, and illumination devices, each emitting light to the plate surface around the through-hole, are inserted in the respective insertion holes. An optical axis direction of each of the illumination devices inserted in the respective insertion holes and the plate surface form an angle of 25 to 60°.

Abstract: A circular scratch inspection apparatus includes: a camera capturing an image of a workpiece surface around a hole; illumination device emitting light to the workpiece surface around the hole, the light being reflected on the workpiece surface is not directly incident on the camera; and image processor. The image processor: generates a second-derivative image by performing secondary differentiation on luminance values in an actual image obtained by the camera; generates a second-derivative curve for each of a plurality of ruler lines, extending radially from the hole center and are set in an inspection target region on the workpiece surface; counts a first reference number of times for each ruler line; calculates a first reference total number of times; and determines presence or absence of a circular scratch by using the first reference total number of times.

Abstract: A measurement method for a laminate substrate is provided. The laminate substrate has: a base substrate; an absorption layer; and a measurement-target layer in this order. The measurement-target layer has a single measurement-target monolayer or a plurality of measurement-target monolayers. The method includes: emitting incident light including light with a wavelength shorter than a threshold wavelength from a side on which the measurement-target layer is positioned, and measuring reflected light and acquiring mutually independent 2n (n is a layer count of the measurement-target monolayers included in the measurement-target layer and is an integer equal to one or larger) or more reflected light-related values for wavelengths equal to the threshold wavelength or shorter; and calculating values related to the measurement-target monolayers for each measurement-target monolayer included in the measurement-target layer using the 2n or more reflected light-related values.

Abstract: Provided is a semiconductor wafer in which a nitride crystal layer on a silicon wafer includes a reaction suppressing layer to suppress reaction between a silicon atom and a Group-III atom, a stress generating layer to generate compressive stress and an active layer in which an electronic element is to be formed, the reaction suppressing layer, the stress generating layer and the active layer are arranged in an order of the reaction suppressing layer, the stress generating layer and the active layer with the reaction suppressing layer being positioned the closest to the silicon wafer, and the stress generating layer includes a first crystal layer having a bulk crystal lattice constant of al and a second crystal layer in contact with a surface of the first crystal layer that faces the active layer, where the second crystal layer has a bulk crystal lattice constant of a2 (a1<a2).

Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

Abstract: An electric device includes a support substrate 12, an electric circuit 14 provided in a sealing region set on the support substrate 12, an electric wiring provided on the support substrate 12 for electrically connecting an external electrical signal input/output source with the electric circuit 14, a sealing member 16 provided on the support substrate 12 to surround the sealing region, and a sealing substrate 17 bonded to the support substrate 12 with the sealing member 16 interposed therebetween. the electric circuit 14 includes an electronic element 24 having an organic layer, and a width of the sealing member 16 differs between an intersection region in which the electric wiring 15 and the sealing member 16 intersect each other and a non-intersection region excluding the intersection region.

Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

Abstract: An electric device includes a support substrate 12, an electric circuit 14 provided in a sealing region set on the support substrate 12, an electric wiring provided on the support substrate 12 for electrically connecting an external electrical signal input/output source with the electric circuit 14, a sealing member 16 provided on the support substrate 12 to surround the sealing region, and a sealing substrate 17 bonded to the support substrate 12 with the sealing member 16 interposed therebetween. the electric circuit 14 includes an electronic element 24 having an organic layer, and a width of the sealing member 16 differs between an intersection region in which the electric wiring 15 and the sealing member 16 intersect each other and a non-intersection region excluding the intersection region.

Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.