Patents by Inventor Kenji Kawagishi

Kenji Kawagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11643485
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: May 9, 2023
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Patent number: 10633471
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: April 28, 2020
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20200031965
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke ASAKAWA, Tsutomu SAKURAGI, Tetsurou FUKUDA, Kazuya SAKATA, Masaru AOKI, Kenji KAWAGISHI, Keiichi YOSHIMOTO
  • Publication number: 20180237565
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 23, 2018
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke ASAKAWA, Tsutomu SAKURAGI, Tetsurou FUKUDA, Kazuya SAKATA, Masaru AOKI, Kenji KAWAGISHI, Keiichi YOSHIMOTO
  • Patent number: 9975972
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 22, 2018
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20160244544
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt/of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: February 11, 2016
    Publication date: August 25, 2016
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki ISHIHAMA, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Patent number: 9309340
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 12, 2016
    Assignee: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto
  • Publication number: 20140194277
    Abstract: An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
    Type: Application
    Filed: March 29, 2012
    Publication date: July 10, 2014
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Yoshiyuki Ishihama, Ryousuke Asakawa, Tsutomu Sakuragi, Tetsurou Fukuda, Kazuya Sakata, Masaru Aoki, Kenji Kawagishi, Keiichi Yoshimoto