Patents by Inventor Kenji Komatsubara

Kenji Komatsubara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11368094
    Abstract: This power supply unit of a control system outputs a notification signal to a calculation unit when a time in which an input voltage becomes smaller than a threshold voltage exceeds a prescribed first measurement time. When detecting that a predetermined second measurement time has elapsed after the notification signal has been received, the calculation unit outputs an instruction signal instructing the execution of a process before a stop in preparation for a prescribed stop of power supply, and executes the process before the stop in place of the current process. Settings of the threshold voltage and the second measurement time are configured to be changeable by means of an external operation.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: June 21, 2022
    Assignee: OMRON Corporation
    Inventors: Tatsuo Ogaki, Seiji Oka, Kenji Komatsubara
  • Publication number: 20210028707
    Abstract: This power supply unit of a control system outputs a notification signal to a calculation unit when a time in which an input voltage becomes smaller than a threshold voltage exceeds a prescribed first measurement time. When detecting that a predetermined second measurement time has elapsed after the notification signal has been received, the calculation unit outputs an instruction signal instructing the execution of a process before a stop in preparation for a prescribed stop of power supply, and executes the process before the stop in place of the current process. Settings of the threshold voltage and the second measurement time are configured to be changeable by means of an external operation.
    Type: Application
    Filed: April 22, 2019
    Publication date: January 28, 2021
    Applicant: OMRON Corporation
    Inventors: Tatsuo OGAKI, Seiji OKA, Kenji KOMATSUBARA
  • Patent number: 10262917
    Abstract: A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: April 16, 2019
    Assignee: KYOCERA Corporation
    Inventors: Yuusaku Ishimine, Kenji Komatsubara
  • Publication number: 20170103935
    Abstract: A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.
    Type: Application
    Filed: March 25, 2015
    Publication date: April 13, 2017
    Inventors: Yuusaku ISHIMINE, Kenji KOMATSUBARA
  • Patent number: 9293384
    Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: March 22, 2016
    Assignee: KYOCERA Corporation
    Inventors: Yuusaku Ishimine, Masayuki Moriyama, Kenji Komatsubara
  • Publication number: 20120281362
    Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.
    Type: Application
    Filed: January 13, 2011
    Publication date: November 8, 2012
    Applicant: KYOCERA CORPORATION
    Inventors: Yuusaku Ishimine, Masayuki Moriyama, Kenji Komatsubara