Abstract: The electronic device includes a master element and a plurality of slave elements that are daisy-chain-connected. The slave element includes an input terminal connected to a slave element adjacently provided on the opposite side of the master element, an output terminal connected to the slave element adjacently provided on the side of the master element or the master element, and a first switch that is provided in a section between the input terminal and the output terminal used as a transmission path of transmission data and is connected to the transmission path in series. The master element receives the transmission data transmitted from the slave element to be the transmission source via the transmission path, and at least the slave element to be the transmission source includes a data transmission unit that is connected to the transmission path via a second switch and transmits the transmission data.

Abstract: The present technology relates to an electronic device, a driving method, and a slave element capable of obtaining sufficient transmission characteristics with low power consumption. The electronic device includes a master element and a plurality of slave elements that are daisy-chain-connected. The slave element includes an input terminal connected to a slave element adjacently provided on the opposite side of the master element, an output terminal connected to the slave element adjacently provided on the side of the master element or the master element, and a first switch that is provided in a section between the input terminal and the output terminal used as a transmission path of transmission data and is connected to the transmission path in series.

Abstract: A busbar unit includes a busbar connected by welding to a connection terminal of a ceramic capacitor and a molding part formed of the molding resin to cover the busbar, the busbar includes a body part covered by the molding part and a terminal part projecting from the molding part and connected to the connection terminal of the ceramic capacitor, and the molding part is formed with a guide hole to guide the connection terminal of the ceramic capacitor to bring the connection terminal into contact with or into proximity to the terminal part.

Abstract: An electronic component holder 100 for holding a cylindrical electrolytic capacitors 5 provided in an electronic control device 10 includes a clip portion 11 that is formed to be capable of expanding and contracting and accommodates the electrolytic capacitor 5 while gripping the outer peripheral surface 5A of the electrolytic capacitor 5, and a restricting portion 30 that is latched to the clip portion 11 to prevent the clip portion 11 from separating from the outer peripheral surface 5A of the electrolytic capacitor 5.

Abstract: A surface mount clip includes: a bottom portion having a flat surface; clip spring portions which extend from parts of the bottom portion and are provided in a standing manner, in a pair facing each other so as to form a gap therebetween, and which are configured to clip a plate material inserted into the gap by a resilient repulsive force; and a bottom spring portion which is formed by cutting and raising a part of the bottom portion or the clip spring portions, and which has an upper surface to be pressed by a lower end of the plate material inserted between the pair of the clip spring portions.

Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Abstract: A surface mount clip includes: a bottom portion having a flat surface; clip spring portions which extend from parts of the bottom portion and are provided in a standing manner, in a pair facing each other so as to form a gap therebetween, and which are configured to clip a plate material inserted into the gap by a resilient repulsive force; and a bottom spring portion which is formed by cutting and raising a part of the bottom portion or the clip spring portions, and which has an upper surface to be pressed by a lower end of the plate material inserted between the pair of the clip spring portions.

Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.

Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.