Patents by Inventor Kenji Kouya

Kenji Kouya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8125794
    Abstract: The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: February 28, 2012
    Assignee: NEC Infrontia Corporation
    Inventor: Kenji Kouya
  • Publication number: 20090237902
    Abstract: The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: NEC INFRONTIA CORPORATION
    Inventor: Kenji KOUYA