Patents by Inventor Kenji Kozu

Kenji Kozu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100301459
    Abstract: The warpage of a semiconductor wafer or a semiconductor chip is inhibited. A method includes a step of successively forming, pads formed over the main surface of the semiconductor chip, an insulation layer formed by covering the main surface such that the pads are exposed, an insulation film formed over the insulation layer such that the pads are exposed, rewirings formed over the insulation film and electrically coupled with the pads, respectively, an insulation film formed over each rewirings such that portions of the rewirings are exposed, and bumps respectively bonded with the regions of the rewirings exposed from the insulation film. Any one of the insulation film and the insulation layer is formed such that a portion of an insulation layer or the insulation film formed closer to the back surface side than the insulation film or the insulation layer is exposed.
    Type: Application
    Filed: May 19, 2010
    Publication date: December 2, 2010
    Inventors: Toshihiko Akiba, Kenji Kozu, Hisao Shigihara