Abstract: A wafer polishing apparatus includes a wafer mount mounting thereon a wafer for rotation, a pair of bell-shaped buff units opposing each other and rotated to polish the periphery of the wafer. The buff units each have an edge-surface polishing section having a shape adapted to half the edge surface of the wafer periphery as divided in the thickness direction of the wafer, and a notch polishing section having a shape corresponding to half the edge surface of a notch of the wafer as divided in the thickness direction.

Abstract: A wafer-edge polishing device includes a buff member for polishing a semiconductor wafer, and a dresser for dressing the buff member, wherein the dresser opposes the buff member with an intervention of the semiconductor wafer. A wafer mount mounting thereon the semiconductor wafer and the dresser are respectively movable toward and from the buff member. The contact pressure between the wafer and the buff member as well as between the buff member and the dresser is fixed. The dresser performs in-situ dressing concurrently with polishing of the wafer by the buff member.