Patents by Inventor Kenji Kumamaru

Kenji Kumamaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID EJECTION HEAD SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD SUBSTRATE
    Publication number: 20190263124
    Abstract: A liquid ejection head substrate that includes a nozzle plate provided with an ejection orifice adapted to eject liquid droplets, in which a projection/depression pattern is provided on a liquid droplet ejection surface of the nozzle plate, the projection/depression pattern being made up of a plurality of projections and depressions, the projections being separated by depressions 1 ?m or less in depth and disposed at predetermined spacing 10 ?m or less in length; and the projection/depression pattern includes a part having water repellency due to lotus effect.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 29, 2019
    Inventors: Kenji Takahashi, Mitsuru Chida, Mitsunori Toshishige, Shiro Sujaku, Kenji Kumamaru, Noriyasu Ozaki, Makoto Terui, Seiko Minami
  • Processes for producing substrate for liquid ejection head
    Patent number: 9102153
    Abstract: A process for producing a substrate for a liquid ejection head, including a step of forming a liquid supply port passing through a silicon substrate by dry etching, the step being a step of sequentially repeating the steps of (1) forming an etching protection film on the silicon substrate, (2) removing a bottom portion of the etching protection film, and (3) etching the silicon substrate, wherein a sheath formed in the step (2) is thicker than a sheath formed in the step (3).
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 11, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiyasu Sakai, Masataka Kato, Kenji Kumamaru
  • PROCESSES FOR PRODUCING SUBSTRATE FOR LIQUID EJECTION HEAD
    Publication number: 20140363907
    Abstract: A process for producing a substrate for a liquid ejection head, including a step of forming a liquid supply port passing through a silicon substrate by dry etching, the step being a step of sequentially repeating the steps of (1) forming an etching protection film on the silicon substrate, (2) removing a bottom portion of the etching protection film, and (3) etching the silicon substrate, wherein a sheath formed in the step (2) is thicker than a sheath formed in the step (3).
    Type: Application
    Filed: May 21, 2014
    Publication date: December 11, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Toshiyasu Sakai, Masataka Kato, Kenji Kumamaru