Abstract: Provided is an air conditioner including an indoor unit provided with a microphone element for receiving voice instructions, such that a voice instruction spoken by an operator is acquired with high quality and control based on the voice instruction spoken by the operator is likely to be ensured. The air conditioner includes an indoor unit, a transmission unit, and a reception unit. The indoor unit has a main body and a microphone element. The main body has formed therein a blow-out port through which air-conditioned air is blown out toward a space to be air-conditioned. The microphone element accepts a voice instruction captured from a voice capturing portion arranged at a position that deviates from a ventilation space through which the air blown out from the blow-out port flows, in such a manner as to face the space to be air-conditioned. The transmission unit transmits the voice instruction accepted by the microphone element to an outside as a signal.

Abstract: Provided is a current measurement module including: a conductor which has two main body portions and two current paths disposed between the two main body portions and extending in parallel with a gap; two magnetic field sensing elements which each have a magnetosensitive surface disposed such that magnetic fields generated by current flowing through the two current paths penetrate the magnetosensitive surface in directions opposite to each other; and a substrate which supports the two magnetic field sensing elements and is attached to the conductor, the two main body portions each have a slit which extends from the gap and is narrower than the gap, and the substrate is inserted into the slit and the gap.

Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.

Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.

Abstract: A current sensor according to the present invention is provided with a U-shaped conductor through which current under measurement flows, a magnetic sensor disposed between two straight portions parallel to each other both of which form the U-shaped conductor, a magnetic material of surrounding shape which surrounds the two straight portions and the magnetic sensor and includes a convex opposed to the magnetic sensor and a supporting member for supporting the conductor, the magnetic sensor and the magnetic material so as to position ends of the conductor and terminals of the magnetic sensor at the same side with respect to the magnetic material.

Abstract: A current sensor according to the present invention is provided with a U-shaped conductor through which current under measurement flows, a magnetic sensor disposed between two straight portions parallel to each other both of which form the U-shaped conductor, a magnetic material of surrounding shape which surrounds the two straight portions and the magnetic sensor and includes a convex opposed to the magnetic sensor and a supporting member for supporting the conductor, the magnetic sensor and the magnetic material so as to position ends of the conductor and terminals of the magnetic sensor at the same side with respect to the magnetic material.