Patents by Inventor Kenji Mitamura

Kenji Mitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic resin composition
    Patent number: 6743849
    Abstract: The invention provides a thermoplastic resin composition having excellent blister resistance, which does not cause blister on the surfaces of resinous parts by passing through a reflowing oven when the resin composition is used as a resin material forming the resinous parts subjected to the surface-mount technology system, particularly, a thermoplastic resin composition high in mechanical strength such as flexural strength, weld strength and tensile elongation and excellent in moldability and friction property.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: June 1, 2004
    Assignee: DSM JSR Engineering Plastics Kabushiki Kaisha
    Inventors: Masaaki Mawatari, Kenji Mitamura
  • Thermoplastic resin composition
    Publication number: 20020019497
    Abstract: The invention provides a thermoplastic resin composition having excellent blister resistance, which does not cause blister on the surfaces of resinous parts by passing through a reflowing oven when the resin composition is used as a resin material forming the resinous parts subjected to the surface-mount technology system, particularly, a thermoplastic resin composition high in mechanical strength such as flexural strength, weld strength and tensile elongation and excellent in moldability and friction property.
    Type: Application
    Filed: June 22, 2001
    Publication date: February 14, 2002
    Applicant: DSM JSR ENGINEERING PLASTICS KABUSHIKI KAISHA
    Inventors: Masaaki Mawatari, Kenji Mitamura