Patents by Inventor Kenji Mitarai

Kenji Mitarai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6960123
    Abstract: A cleaning sheet has a disc-shaped substrate. First and second polishing layers are disposed over the substrate. The first polishing layer has a surface formed in a surface-roughened fashion to polish a tip section of each probe needle and has the function of removing adherents leading to inhibition of electrical conduction, which have been adhered to the tip of the needle in a coating or film form. The second polishing layer is a layer in which a large number of polishing grains are mixed into an elastic member and has the function of sticking the tip of the probe needle into the elastic member to remove foreign substances. The height of the surface of the second polishing layer is set so as to become identical to or slightly higher than that of the surface of the first polishing layer.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: November 1, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Kenji Mitarai
  • Publication number: 20050191952
    Abstract: A cleaning sheet has a disc-shaped substrate. First and second polishing layers are disposed over the substrate. The first polishing layer has a surface formed in a surface-roughened fashion to polish a tip section of each probe needle and has the function of removing adherents leading to inhibition of electrical conduction, which have been adhered to the tip of the needle in a coating or film form. The second polishing layer is a layer in which a large number of polishing grains are mixed into an elastic member and has the function of sticking the tip of the probe needle into the elastic member to remove foreign substances. The height of the surface of the second polishing layer is set so as to become identical to or slightly higher than that of the surface of the first polishing layer.
    Type: Application
    Filed: October 21, 2004
    Publication date: September 1, 2005
    Inventor: Kenji Mitarai