Abstract: A composition for cleaning a semiconductor substrate contains: a novolak resin; an organic acid not being a polymeric compound; and a solvent. A solid content concentration of the composition is no greater than 20% by mass. The organic acid is preferably a carboxylic acid. The carboxylic acid is preferably a monocarboxylic acid, polycarboxylic acid or a combination thereof. The molecular weight of the organic acid is preferably from 50 to 500. The content of the organic acid with respect to 10 parts by mass of the novolak resin is preferably from 0.001 parts by mass to 10 parts by mass. The solvent includes preferably an ether solvent, an alcohol solvent, or a combination thereof. The proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is preferably no less than 50% by mass.

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Abstract: A display light-equipped transmitter 100 providing notification of an abnormality in a monitoring region includes a light emitting unit and a front cover 1 covering the light emitting unit from a front side of the display light-equipped transmitter 100 and provided with a transmitting region 13 transmitting light emitted by the light emitting unit to an outside of the display light-equipped transmitter 100 on a front side of the display light-equipped transmitter 100 and a non-transmitting region 14 not transmitting light emitted by the light emitting unit to an outside of the display light-equipped transmitter 100 on a front side of the display light-equipped transmitter 100.

Abstract: A composition for cleaning a semiconductor substrate contains: a novolak resin; an organic acid not being a polymeric compound; and a solvent. A solid content concentration of the composition is no greater than 20% by mass. The organic acid is preferably a carboxylic acid. The carboxylic acid is preferably a monocarboxylic acid, polycarboxylic acid or a combination thereof. The molecular weight of the organic acid is preferably from 50 to 500. The content of the organic acid with respect to 10 parts by mass of the novolak resin is preferably from 0.001 parts by mass to 10 parts by mass. The solvent includes preferably an ether solvent, an alcohol solvent, or a combination thereof. The proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is preferably no less than 50% by mass.

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Abstract: A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

Abstract: A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Abstract: A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

Abstract: Provided are: a (meth)acrylic resin molded body having superior transparency and shock resistance; a method for producing same; and a method for producing a (meth)acrylic resin composition that can provide the (meth)acrylic resin molded body. In the method for producing a (meth)acrylic resin composition containing a (meth)acrylic polymer (A), which has a methyl methacrylate unit, and an olefin-alkyl(meth)acrylate copolymer (B), a monomer starting material containing methyl methacrylate is polymerized in the presence of the olefin-alkyl(meth)acrylate copolymer (B) using a specific polymerization initiator, obtaining a (meth)acrylic polymer (A) having methyl methacrylate units. Further provided are: a (meth)acrylic resin molded body obtained from the (meth)acrylic resin composition; a front surface plate for a liquid crystal display device using the (meth)acrylic resin molded body; and a touch panel.

Abstract: PAH is subjected to C—H/C—B coupling using a specific boron compound, a palladium compound, and o-chloranil to produce a compound in which a C—H bond of the PAH is directly arylated regioselectively in a simple manner. When the substrate and the boron compound are appropriately selected, a larger PAH can also be obtained by further performing an annulation reaction after the coupling reaction. Similarly, when PAH is subjected to C—H/C—H cross-coupling using a specific aromatic compound, a palladium compound, and o-chloranil, a compound in which a C—H bond of the PAH is directly arylated regioselectively can be produced in a simple manner. When the substrate and the aromatic compound are appropriately selected in this case, a larger PAH can also be obtained by further performing an annulation reaction after the cross-coupling reaction.

Abstract: PAH is subjected to C—H/C—B coupling using a specific boron compound, a palladium compound, and o-chloranil to produce a compound in which a C—H bond of the PAH is directly arylated regioselectively in a simple manner. When the substrate and the boron compound are appropriately selected, a larger PAH can also be obtained by further performing an annulation reaction after the coupling reaction. Similarly, when PAH is subjected to C—H/C—H cross-coupling using a specific aromatic compound, a palladium compound, and o-chloranil, a compound in which a C—H bond of the PAH is directly arylated regioselectively can be produced in a simple manner. When the substrate and the aromatic compound are appropriately selected in this case, a larger PAH can also be obtained by further performing an annulation reaction after the cross-coupling reaction.

Abstract: A power driven vessel is able to accommodate various types of power drive. The power driven vessel includes a vessel main body, power drive having an engine and a driving unit, an attachment member for mounting the power drive thereon, an insert recess portion formed within the rear portion of vessel main body, and a bottom plate disposed on the insert recess portion. The attachment member is movable between an upper position and a lower position in the vessel, and is directly placed on the bottom plate and inserted in the insert recess portion when the attachment member is held in the lower position.

Abstract: A method for determining air borne bacteria which includes successive steps of passing a volume of air by a timed suction pump through a membrane filter at a membrane passing velocity of not more than 15 cm/sec and under a constant transmembrane pressure of not more than 100 mmHg to collect the air borne bacteria on the surface of the membrane filter. The membrane filter has a multiplicity of minute holes and is provided on a medium-absorbing pad housed in a holder. A medium is injected into the medium-absorbing pad housed in said holder. The bacteria thus collected are incubated and the number of the colonies developed on the surface of said membrane filter is measured.

Abstract: An arrangement for restraining a hood of a vehicle body comprises a junction member attached to a corner portion of the vehicle body, where an end portion of a cowl panel extending along a lower end portion of a front windshield is coupled with a wheel apron member, for reinforcing the corner portion, and a hook member projecting from an inner surface of the hood which is provided for opening and closing an opening, such as creating an engine room, formed in the vehicle body in front of the cowl panel, so as to be positioned to face the junction member when the hood is positioned to close the opening. The hook member engages with the junction member in the case where the hood is moved toward a cabin space formed in the vehicle body behind the cowl panel.