Patents by Inventor Kenji Mori

Kenji Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230384728
    Abstract: An image forming apparatus includes: plural image forming units that form images to be transferred to a recording medium; and a processor configured to cause an information display image to be transferred to a recording medium to which a diagnostic image that has been formed by a diagnosis target image forming unit, which is an image forming unit as a target for a diagnosis among the plural image forming units, is transferred, the information display image being an image representing information and having been formed by a different image forming unit.
    Type: Application
    Filed: November 2, 2022
    Publication date: November 30, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Kenji SAWAI, Junichiro MORI
  • Patent number: 11828591
    Abstract: Even using the redundant system resolver in which the magnetic interference between systems occurs, to provide an angle detection apparatus which can reduces the influence of the magnetic interference and can calculate the rotational angle with good accuracy, without performing synchronous control between systems in real time. An angle detection apparatus is provided with a resolver which has the first system windings and the second system windings in which magnetic interference occurs between systems; a first system removal processing unit that performs a second cycle component removal processing which removes component of the second cycle of the second system, to detection values of the first system winding output signals; and a first system angle calculation unit that calculates a first angle of rotor, based on the detection values of the first system winding output signals after the second cycle component removal processing.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: November 28, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tatsuya Mori, Toshihiro Matsunaga, Hiroko Ikeda, Seiji Sawada, Kenta Kubo, Kenji Ikeda
  • Patent number: 11798719
    Abstract: A soft magnetic metal powder having soft magnetic metal particles, wherein a surface of the soft magnetic metal particle is covered by a coating part, the coating part has a first coating part, a second coating part, and a third coating part in this order from the surface of the soft magnetic metal particle towards outside, the first coating part includes oxides of Si as a main component, the second coating part includes oxides of Fe as a main component, and the third coating part includes a compound of at least one element selected from the group consisting of P, Si, Bi, and Zn.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 24, 2023
    Assignee: TDK CORPORATION
    Inventors: Kazuhiro Yoshidome, Hiroyuki Matsumoto, Kenji Horino, Satoko Mori, Takuma Nakano, Seigo Tokoro, Shota Otsuka, Toru Ujiie, Kentaro Mori
  • Patent number: 11788738
    Abstract: An outdoor unit includes a housing that includes a front panel and a back panel facing the front panel. The outdoor unit further includes a bell mouth provided on the front panel and a heat dissipator that dissipates heat generated by electric components. A windward end surface and a leeward end surface of the heat dissipator are, when viewed from above, placed in a region between a virtual surface and the back panel, the virtual surface being a virtual surface that is in contact with an end of the bell mouth on a side of the back panel and is parallel to an inner surface of the front panel.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: October 17, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Shimomugi, Keisuke Mori, Koichi Arisawa, Satoru Ichiki, Keisuke Uemura, Kenji Iwazaki
  • Patent number: 11787126
    Abstract: A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 17, 2023
    Assignees: TOYOTA CUSTOMIZING & DEVELOPMENT CO., LTD., AISIN SEIKI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, TORAY INDUSTRIES, INC., TEIJIN LIMITED, KOMATSU LTD., SUBARU CORPORATION
    Inventors: Kenji Furuyashiki, Hiroshi Yuchi, Satoshi Hirawaki, Yoshinori Yamamori, Takayuki Mori, Yoshihiro Iwano, Kazuaki Amaoka
  • Patent number: 11785721
    Abstract: First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: October 10, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Haruki Kondoh, Rentaro Mori, Keiji Kuroda, Kazuaki Okamoto, Akira Kato, Jyunya Murai, Hiroshi Yanagimoto, Kenji Nakamura, Tomoya Okazaki
  • Publication number: 20230313341
    Abstract: A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 5, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Patent number: 11763969
    Abstract: A soft magnetic metal powder having soft magnetic metal particles including Fe, wherein a surface of the soft magnetic metal particle is covered by a coating part, the coating part has a first coating part and a second coating part in this order from the surface of the soft magnetic metal particle towards outside, the first coating part includes oxides of Fe as a main component, the second coating part includes a compound of at least one element selected from the group consisting of P, Si, Bi, and Zn, and a ratio of trivalent Fe atom among Fe atoms of oxides of Fe included in the first coating part is 50% or more.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 19, 2023
    Assignee: TDK CORPORATION
    Inventors: Kazuhiro Yoshidome, Hiroyuki Matsumoto, Kenji Horino, Satoko Mori, Takuma Nakano, Seigo Tokoro, Shota Otsuka, Toru Ujiie, Kentaro Mori
  • Publication number: 20230285073
    Abstract: [Object] Provided is a catheter that can enhance the smoothness of a lumen. Solution A balloon catheter includes: an outer shaft to be inserted into a body, the outer shaft including a main lumen that extends in an axial direction from a proximal end side toward a distal end side; and a second member exposed in a portion of an inner circumferential surface of the outer shaft to the main lumen and having frictional properties lower than those of a first member (an inner shaft) that forms the inner circumferential surface of the outer shaft. The balloon catheter further includes sub-shafts that include sub-lumens extending in the axial direction and that are formed of the second member, and a portion of outer circumferential surfaces of the sub-shafts is exposed in a portion of the inner circumferential surface of the outer shaft to the main lumen.
    Type: Application
    Filed: March 7, 2023
    Publication date: September 14, 2023
    Inventor: Kenji MORI
  • Patent number: 11752073
    Abstract: An embodiment according to the present invention provides a dental gypsum powder including a hemihydrate gypsum and a water-reducing agent, wherein the mass ratio of the water-reducing agent to the hemihydrate gypsum is 0.1 to 1%, the content of particles having a particle diameter of 10 ?m or less is 15 to 35 volume %, the content of particles having a particle diameter of 20 ?m or less is 40 to 55 volume %, and the content of particles having a particle diameter of 30 ?m or less is 55 to 75 volume %.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 12, 2023
    Assignee: GC Corporation
    Inventors: Daizaburo Mori, Kenji Kojima, Masatoshi Yoshinaga
  • Patent number: 11750134
    Abstract: To provide an AC rotary machine apparatus which can determine the operation stop of the control circuit of the other system with good accuracy. An AC rotary machine apparatus, including: a resolver is provided with a first system excitation winding, first system two output windings, a second system excitation winding, and second system two output windings, in which a magnetic interference occurs between a first system and a second system; a first system control circuit that applies AC voltage with a first period to the first system excitation winding; and a second system control circuit that applies AC voltage with a second period to the second system excitation winding, wherein the first system control circuit determines whether the operation of the second system control circuit stops, based on the components of the second period extracted from the first system output signals.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: September 5, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tatsuya Mori, Hiroko Ikeda, Toshihiro Matsunaga, Kenji Ikeda, Kenta Kubo
  • Patent number: 11748753
    Abstract: A clearing delay estimate may be employed that provides issuers with an accurate estimate for when a transaction will be cleared, thus providing more transparency to issuers to more efficiently manage funds. An algorithm may be employed to estimate clearance timing information and insert the timing information into communications with the issuer or other parties to a transaction involving a payment device. The estimated clearance timing information may be determined based on machine learning and other artificial intelligence techniques using historical data related to clearance timing for the particular entities involved in each transaction.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: September 5, 2023
    Assignee: Visa International Service Association
    Inventors: Michael Kenji Mori, Gourab Basu
  • Publication number: 20230270490
    Abstract: A balloon-type electrode catheter includes a catheter shaft, a balloon provided at a part including a distal end of the catheter shaft and being inflatable with a fluid, and an electrode. The balloon includes a through hole discharging a fluid in the balloon to an outside of the balloon, a distal end large diameter portion, a proximal end large diameter portion, a small diameter portion positioned between the two large diameter portions and being smaller in diameter than the two large diameter portions, a distal end inclined portion connecting the distal end large diameter portion and the small diameter portion, and a proximal end inclined portion connecting the proximal end large diameter portion and the small diameter portion. The electrode is exposed at at least the small diameter portion. The through hole is disposed in at least one of the distal end inclined portion or the proximal end inclined portion.
    Type: Application
    Filed: January 23, 2023
    Publication date: August 31, 2023
    Inventors: Kenji MORI, Yohei SUZUKI
  • Publication number: 20230270491
    Abstract: A balloon-type electrode catheter includes a catheter shaft including an outer shaft and an inner shaft, a balloon provided at a part including a distal end of the catheter shaft, and an electrode. The balloon includes an outer joining portion an inner joining portion, a distal end large diameter portion, a proximal end large diameter portion, a small diameter portion positioned between the two large diameter portions and being smaller in diameter than the two large diameter portions, a distal end inclined portion connecting the distal end large diameter portion and the small diameter portion, and a proximal end inclined portion connecting the proximal end large diameter portion and the small diameter portion. The electrode is exposed at at least the small diameter portion.
    Type: Application
    Filed: January 26, 2023
    Publication date: August 31, 2023
    Inventors: Kenji MORI, Yohei SUZUKI
  • Publication number: 20230258924
    Abstract: A cleaning device includes a housing holding an imaging device, a protective cover located in a field of view of the imaging device, a vibrator to vibrate the protective cover, a piezoelectric driver to drive the vibrator, a cleaning liquid discharger to discharge, onto a surface of the protective cover, a cleaning liquid including an abrasive, and a signal processing circuit to control the piezoelectric driver and the cleaning liquid discharger. When causing the cleaning liquid discharger to discharge the cleaning liquid, the signal processing circuit can control the piezoelectric driver such that the protective cover is vibrated at a vibration acceleration of larger than about 8.0×105 m/s2 and equal to or less than about 21.0×105 m/s2.
    Type: Application
    Filed: April 13, 2023
    Publication date: August 17, 2023
    Inventors: Kenji NISHIYAMA, Takaaki MORI
  • Publication number: 20230250514
    Abstract: This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 10, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Publication number: 20230243019
    Abstract: This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200° C. or higher. The residual stress ratio RSG at 180° C. for 30 hours is 20% or greater. The ratio RSG/RSB at 180° C. for 30 hours is greater than 1.0.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Publication number: 20230243020
    Abstract: A copper alloy plastically-worked material comprises Mg in the amount of greater than 10 mass ppm and 100 mass ppm or less and a balance of Cu and inevitable impurities, that comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less, the electrical conductivity is 97% IACS or greater. The tensile strength is 200 MPa or greater. The heat-resistant temperature is 150° C. or higher.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Publication number: 20230243018
    Abstract: This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, in which among the inevitable impurities, a S amount is 10 mass ppm or less, a P amount is 10 mass ppm or less, a Se amount is 5 mass ppm or less, a Te amount is 5 mass ppm or less, an Sb amount is 5 mass ppm or less, a Bi amount is 5 mass ppm or less, an As amount is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater, and a residual stress ratio at 150° C. for 1000 hours is 20% or greater.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Patent number: 11707572
    Abstract: A cartridge adapter includes: a cartridge holder having a space that can accommodate therein a drug cartridge, the drug cartridge including a cylinder having a tubular internal space extending in a longitudinal direction, a gasket supported in the internal space so as to be movable in the longitudinal direction, and a drug held in the internal space; a piston that moves the gasket in the longitudinal direction in the internal space of the cylinder; a piston guide that movably supports the piston and connected to the cartridge holder; and a piston driving mechanism that drives the piston in the longitudinal direction.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 25, 2023
    Assignee: PHC HOLDINGS CORPORATION
    Inventors: Kenji Murakami, Mitsuteru Fujimoto, Seiji Kikuchi, Toru Aoki, Masakazu Mori, Ryosuke Tani, Shinichi Kojima, Yoshihiro Kataoka, Katsumi Nakanishi, Tsuguhiro Kondo, Takashi Morimoto, Akio Inoki