Patents by Inventor Kenji Morikawa
Kenji Morikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11965444Abstract: A controller for an internal combustion engine is configured to execute a determination process that determines that a deviation between a first change amount and a second change amount during a fuel cutoff operation is less than or equal to a threshold, and an anomaly diagnosing process that determines that an exhaust purification device is in a detached state when the determination process determines that the deviation is less than or equal to the threshold. The first change amount and the second change amount are change amounts per unit time of the temperature of exhaust gas on the upstream side and the downstream side of the exhaust purification device, respectively. The controller is configured to interrupt the determination process when the upstream-side temperature increases within a determination period.Type: GrantFiled: June 6, 2023Date of Patent: April 23, 2024Assignee: Toyota Jidosha Kabushiki KaishaInventors: Toru Yaeo, Yoshifumi Matsuda, Masashi Hakariya, Atsushi Morikawa, Ikuo Hoda, Noriyasu Adachi, Masanori Hayashi, Kenji Igawa
-
Patent number: 11926889Abstract: A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/?m or more and 1000% by mass/?m or less.Type: GrantFiled: August 5, 2020Date of Patent: March 12, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Kenji Morikawa, Naoki Miyashima, Kazunari Maki, Shinichi Funaki
-
Publication number: 20230327474Abstract: A charge controller including: an environment prediction part that predicts, during charging of a battery mounted on a vehicle, a state of an external environment of the vehicle after an end of charging; a target temperature setting part that sets a target temperature of the battery at the end of charging on the basis of the state of the external environment predicted by the environment prediction part; and temperature adjusting part that adjusts a temperature of the battery during the charge such that the temperature of the battery becomes the target temperature set by the target temperature setting part at the end of charging.Type: ApplicationFiled: August 27, 2021Publication date: October 12, 2023Inventor: Kenji MORIKAWA
-
Publication number: 20230313341Abstract: A copper alloy plastically-worked material comprises Mg in the amount of 10-100 mass ppm and a balance of Cu and inevitable impurities, which comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less. The electrical conductivity is 97% IACS or greater. The tensile strength is 275 MPa or less. The heat-resistant temperature after draw working is 150° C. or higher.Type: ApplicationFiled: June 30, 2021Publication date: October 5, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Yuki ITO, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
-
Publication number: 20230250514Abstract: This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.Type: ApplicationFiled: June 30, 2021Publication date: August 10, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
-
Publication number: 20230243018Abstract: This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, in which among the inevitable impurities, a S amount is 10 mass ppm or less, a P amount is 10 mass ppm or less, a Se amount is 5 mass ppm or less, a Te amount is 5 mass ppm or less, an Sb amount is 5 mass ppm or less, a Bi amount is 5 mass ppm or less, an As amount is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater, and a residual stress ratio at 150° C. for 1000 hours is 20% or greater.Type: ApplicationFiled: June 30, 2021Publication date: August 3, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
-
Publication number: 20230243019Abstract: This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200° C. or higher. The residual stress ratio RSG at 180° C. for 30 hours is 20% or greater. The ratio RSG/RSB at 180° C. for 30 hours is greater than 1.0.Type: ApplicationFiled: June 30, 2021Publication date: August 3, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
-
Publication number: 20230243020Abstract: A copper alloy plastically-worked material comprises Mg in the amount of greater than 10 mass ppm and 100 mass ppm or less and a balance of Cu and inevitable impurities, that comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less, the electrical conductivity is 97% IACS or greater. The tensile strength is 200 MPa or greater. The heat-resistant temperature is 150° C. or higher.Type: ApplicationFiled: June 30, 2021Publication date: August 3, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hirotaka MATSUNAGA, Yuki ITO, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
-
Publication number: 20220316028Abstract: A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/?m or more and 1000% by mass/?m or less.Type: ApplicationFiled: August 5, 2020Publication date: October 6, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Kenji Morikawa, Naoki Miyashima, Kazunari Maki, Shinichi Funaki
-
Patent number: 8191432Abstract: A load detecting device includes a substrate, a load receiver arranged on a first face of the substrate, a load detecting element arranged between the substrate and the load receiver, and a supporting portion to support the substrate. The supporting portion is made of metal. The supporting portion is located to overlap with the load receiver in a direction approximately perpendicular to the substrate. The supporting portion has a plurality of projections contacting with a second face of the substrate opposite from the first face. The projections located adjacent to each other are distanced from each other through a trench.Type: GrantFiled: March 9, 2010Date of Patent: June 5, 2012Assignee: Denso CorporationInventors: Hideyuki Hayakawa, Toshio Hosokawa, Kenji Morikawa
-
Patent number: 8141431Abstract: A method for manufacturing a load sensor including a load detection element and a support element is provided. The support element includes a base and a spring. The spring includes a support portion, a connection portion bonding to the base, and a connecting member coupling the support portion and the connection portion. The support element transmits a detection load to the load detection element via the base and the spring. The method includes: sandwiching the load detection element between the base and the support portion; bonding the connection portion on the base so that the connecting member is deformed beyond the elastic deformation region to reach the plastic deformation region; pressing the support portion so that a contact surface of the support portion is plastically deformed; and returning deformation of the connecting member to be in the elastic deformation region.Type: GrantFiled: February 19, 2009Date of Patent: March 27, 2012Assignee: Denso CorporationInventors: Kenji Morikawa, Hideyuki Hayakawa
-
Patent number: 7926826Abstract: A wheel-side end of a connection link is freely inclined relative to the wheel. A shaft-side end of the connection link is movable substantially in a width direction of the vehicle for steering the wheel. A steering shaft body is substantially in a rod shape extending substantially in the width direction. A steering shaft end is fixed to one end of the steering shaft body and freely inclined relative to the shaft-side end. The steering shaft body and the steering shaft end are movable substantially in the width direction according to an operation of a steering device. A load sensor is interposed between the steering shaft end and the steering shaft body for detecting load applied in an axial direction of the steering shaft to detect force applied to the wheel.Type: GrantFiled: March 26, 2009Date of Patent: April 19, 2011Assignee: Denso CorporationInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Patent number: 7870796Abstract: A detection element detects at least compression load. A first member has a surface provided with the detection element. A preload adjusting member is substantially in a column shape and has a tip end configured to apply pressure to the detection element. The first member and the second member are connected with each other and configured to transmit load to the detection element. The second member has a fitted portion, which has an inner circumferential periphery being press-fitted with the preload adjusting member. The second member causes elastic deformation in response to adjustment of press-fitting of the preload adjusting member and causes change in preload applied to the detection element.Type: GrantFiled: March 19, 2009Date of Patent: January 18, 2011Assignee: Denso CorporationInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Patent number: 7844102Abstract: A sensing apparatus includes a reference voltage generation circuit for generating a first and a second reference signals having different constant voltage levels, an A/D conversion circuit having a ring-gate-delay circuit, and a correction circuit for correcting an output value of the A/D conversion circuit. The A/D conversion circuit converts a load signal and the first and second reference signals to digital data based on the number of times a pulse signal input to the ring-gate-delay circuit circulates through the ring-gate-delay circuit. The correction circuit corrects the output value based on a ratio of a first difference between the digital data to a second difference between the digital data.Type: GrantFiled: March 23, 2006Date of Patent: November 30, 2010Assignee: Denso CorporationInventor: Kenji Morikawa
-
Patent number: 7832284Abstract: A detection element detects at least compression load. A first member has a surface provided with the detection element. A preload adjusting member has a tip end configured to apply pressure to the detection element. The first member and the second member are connected with each other and configured to transmit load to the detection element. The second member has a fitted portion, which has an inner circumferential periphery defining a thread groove, which is screwed with the preload adjusting member. The second member causes elastic deformation in response to adjustment of screwing of the preload adjusting member and causes change in preload applied to the detection element. A buffer member is interposed between the preload adjusting member and the detection element.Type: GrantFiled: March 24, 2009Date of Patent: November 16, 2010Assignee: Denso CorporationInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Publication number: 20100229655Abstract: A load detecting device includes a substrate, a load receiver arranged on a first face of the substrate, a load detecting element arranged between the substrate and the load receiver, and a supporting portion to support the substrate. The supporting portion is made of metal. The supporting portion is located to overlap with the load receiver in a direction approximately perpendicular to the substrate. The supporting portion has a plurality of projections contacting with a second face of the substrate opposite from the first face. The projections located adjacent to each other are distanced from each other through a trench.Type: ApplicationFiled: March 9, 2010Publication date: September 16, 2010Applicant: DENSO CORPORATIONInventors: Hideyuki Hayakawa, Toshio Hosokawa, Kenji Morikawa
-
Publication number: 20090243245Abstract: A wheel-side end of a connection link is freely inclined relative to the wheel. A shaft-side end of the connection link is movable substantially in a width direction of the vehicle for steering the wheel. A steering shaft body is substantially in a rod shape extending substantially in the width direction. A steering shaft end is fixed to one end of the steering shaft body and freely inclined relative to the shaft-side end. The steering shaft body and the steering shaft end are movable substantially in the width direction according to an operation of a steering device. A load sensor is interposed between the steering shaft end and the steering shaft body for detecting load applied in an axial direction of the steering shaft to detect force applied to the wheel.Type: ApplicationFiled: March 26, 2009Publication date: October 1, 2009Applicant: DENSO CORPORATIONInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Publication number: 20090241690Abstract: A detection element detects at least compression load. A first member has a surface provided with the detection element. A preload adjusting member has a tip end configured to apply pressure to the detection element. The first member and the second member are connected with each other and configured to transmit load to the detection element. The second member has a fitted portion, which has an inner circumferential periphery defining a thread groove, which is screwed with the preload adjusting member. The second member causes elastic deformation in response to adjustment of screwing of the preload adjusting member and causes change in preload applied to the detection element. A buffer member is interposed between the preload adjusting member and the detection element.Type: ApplicationFiled: March 24, 2009Publication date: October 1, 2009Applicant: DENSO CORPORATIONInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Publication number: 20090235760Abstract: A detection element detects at least compression load. A first member has a surface provided with the detection element. A preload adjusting member is substantially in a column shape and has a tip end configured to apply pressure to the detection element. The first member and the second member are connected with each other and configured to transmit load to the detection element. The second member has a fitted portion, which has an inner circumferential periphery being press-fitted with the preload adjusting member. The second member causes elastic deformation in response to adjustment of press-fitting of the preload adjusting member and causes change in preload applied to the detection element.Type: ApplicationFiled: March 19, 2009Publication date: September 24, 2009Applicant: DENSO CORPORATIONInventors: Hideyuki Hayakawa, Kenji Morikawa
-
Publication number: 20090211365Abstract: A method for manufacturing a load sensor including a load detection element and a support element is provided. The support element includes a base and a spring. The spring includes a support portion, a connection portion bonding to the base, and a connecting member coupling the support portion and the connection portion. The support element transmits a detection load to the load detection element via the base and the spring. The method includes: sandwiching the load detection element between the base and the support portion; bonding the connection portion on the base so that the connecting member is deformed beyond the elastic deformation region to reach the plastic deformation region; pressing the support portion so that a contact surface of the support portion is plastically deformed; and returning deformation of the connecting member to be in the elastic deformation region.Type: ApplicationFiled: February 19, 2009Publication date: August 27, 2009Applicant: DENSO CORPORATIONInventors: Kenji Morikawa, Hideyuki Hayakawa