Patents by Inventor Kenji Motohashi

Kenji Motohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8605448
    Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 10, 2013
    Assignee: Ricoh Company, Limited
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki
  • Patent number: 8030580
    Abstract: A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a position in proximity to the pair of signal pads, and a via configured to connect the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or via a lead wire led out from the ground pad. The via is located at a substantially equal position spaced away from the first signal pad and the second signal pad.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: October 4, 2011
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki
  • Publication number: 20110222247
    Abstract: A printed wiring board includes a bridge located in a surface layer, a noise absorber located on the bridge, a plurality of grounds directly connected or high-frequency-connected to the bridge, a first device using one of the plurality of grounds as a reference potential, a second device using one of the plurality of grounds other than the ground for the first device as a reference potential, and a high-speed signal line that connects the first device and the second device. The high-speed signal line is routed through a layer adjacent to the bridge in a layer direction of the printed wiring board to form a transmission line structure.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 15, 2011
    Applicant: Ricoh Company, Limited.
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki
  • Patent number: 7643980
    Abstract: An electromagnetic field analysis apparatus includes an information input device configured to input information as to wirings and components of an analysis object and a modeling device configured to generate a simulation model of the analysis object based on the inputted information as to wirings and components of the analysis object. A model simplification device simplifies the simulation model into a simplified simulation model by dividing the analysis object according to the simulation model into a plurality of cells and thinning out, when a plurality of elements are included in a cell, the plurality of elements.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: January 5, 2010
    Assignee: Ricoh Company, Ltd.
    Inventors: Kikuo Kazama, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kenji Motohashi
  • Patent number: 7598747
    Abstract: A noise injection apparatus for injecting noise to a printed circuit board is disclosed that includes a signal generator that generates noise, a coaxial cable having one end connected to an output of the signal generator, and a probe that is connected to another end of the coaxial cable and is configured to convey the noise generated by the signal generator to a power supply and a ground pin of a device element of the printed circuit board via the coaxial cable.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: October 6, 2009
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kikuo Kazama
  • Publication number: 20090014206
    Abstract: A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a position in proximity to the pair of signal pads, and a via configured to connect the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or via a lead wire led out from the ground pad. The via is located at a substantially equal position spaced away from the first signal pad and the second signal pad.
    Type: Application
    Filed: July 10, 2008
    Publication date: January 15, 2009
    Applicant: RICOH COMPANY, LTD,
    Inventors: Kenji MOTOHASHI, Hideji Miyanishi, Kazumasa Aoki
  • Patent number: 7355413
    Abstract: A testing method for measuring electromagnetic interference of a noise on a to-be-tested printed circuit board, has the steps of: a) injecting a signal simulating an expected noise of a predetermined device mounted on the to-be-tested printed circuit board, into the to-be-tested printed circuit board, in a condition in which at least the predetermined device is not actually mounted on the to-be-tested printed circuit board; and b) measuring electromagnetic interference of the signal.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: April 8, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kikuo Kazama
  • Patent number: 7338290
    Abstract: A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: March 4, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenji Motohashi, Takashi Yanagimoto, Hideji Miyanishi, Kazumasa Aoki
  • Publication number: 20070178760
    Abstract: A noise injection apparatus for injecting noise to a printed circuit board is disclosed that includes a signal generator that generates noise, a coaxial cable having one end connected to an output of the signal generator, and a probe that is connected to another end of the coaxial cable and is configured to convey the noise generated by the signal generator to a power supply and a ground pin of a device element of the printed circuit board via the coaxial cable.
    Type: Application
    Filed: January 18, 2007
    Publication date: August 2, 2007
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kikuo Kazama
  • Publication number: 20070093107
    Abstract: A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.
    Type: Application
    Filed: October 25, 2006
    Publication date: April 26, 2007
    Inventors: Kenji Motohashi, Takashi Yanagimoto, Hideji Miyanishi, Kazumasa Aoki
  • Publication number: 20060181287
    Abstract: A testing method for measuring electromagnetic interference of a noise on a to-be-tested printed circuit board, has the steps of: a) injecting a signal simulating an expected noise of a predetermined device mounted on the to-be-tested printed circuit board, into the to-be-tested printed circuit board, in a condition in which at least the predetermined device is not actually mounted on the to-be-tested printed circuit board; and b) measuring electromagnetic interference of the signal.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 17, 2006
    Inventors: Kenji Motohashi, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kikuo Kazama
  • Publication number: 20060173662
    Abstract: An electromagnetic field analysis apparatus includes an information input device configured to input information regarding wirings and components of an analysis object and a modeling device configured to generate a simulation model of the analysis object based on the inputted information regarding the wirings and the components of the analysis object. A model simplification device simplifies the simulation model into a simplified simulation model by dividing the analysis object according to the simulation model into a plurality of cells and thinning out, when a plurality of elements are included in a cell, the plurality of elements included in the cell such that difference between a calculation result of an electromagnetic field distribution of the analysis object according to the simplified simulation model and a measurement result of actual electromagnetic field distribution of the analysis object is minimal.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 3, 2006
    Inventors: Kikuo Kazama, Hideji Miyanishi, Kazumasa Aoki, Toshinobu Shoji, Kenji Motohashi