Patents by Inventor Kenji Nishihara

Kenji Nishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090170323
    Abstract: A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, whereby the plurality of projection patterns have different area ratios R with respect to the corresponding substrates, and performing a flattening process on the interlayer insulating films before linear approximation; a step of obtaining a linear approximation formula R=aT+b expressing a relationship between the area ratio R and a polishing time T, where R1, R2, R3, . . . , Rx represent the area ratio R of each of the projecting patterns with respect to the corresponding substrates, and T1, T2, T3, . . .
    Type: Application
    Filed: December 19, 2008
    Publication date: July 2, 2009
    Inventors: MASANORI MIYATA, Taro Usami, Koichi Sogawa, Kenji Nishihara, Tadao Uehara, Shisyo Chin, Hiroaki Teratani, Akinori Suzuki, Yuuichi Kohno, Tetsuya Okada, Tohru Haruki
  • Publication number: 20080276588
    Abstract: A rear discharge mower comprising: a first shaft; a first blade that is rotated in unison with the first shaft; a second shaft that is configured to be rotated in a direction opposite from a rotational direction of the first shaft; a second blade that is rotated in unison with the second shaft, wherein a grass-clippings discharge path is formed through which grass clippings are discharged in a rearward direction from the area between the first shaft and second shaft; an enclosing casing that supports the blade shafts; and a power train that is accommodated in the enclosing casing and that transmits power to the first and second blade shafts.
    Type: Application
    Filed: March 19, 2008
    Publication date: November 13, 2008
    Applicant: Kubota Corporation
    Inventors: Kenji Nishihara, Takashi Kuramoto, Masashi Osuga, Takashi Shibata, Satoshi Ogata, Hironobu Nishihara, Hiroshi Kawabata
  • Patent number: 7222485
    Abstract: A hydrostatic continuously variable transmission comprises: a hydraulic pump; a power input shaft engaged with the hydraulic pump to transmit power from a power source to the hydraulic pump; a hydraulic motor in hydraulic communication with the hydraulic pump; a casing that houses the hydraulic pump and the hydraulic motor; a port block mounted to the casing, the port block having a block main body and a cover member connected to a power input side of the block main body, said cover member having an outer surface; a cooling hydraulic path provided in the port block in a region where the block main body and the cover member meet, the cooling hydraulic path being connected to a first hydraulic path in the port block, the cooling hydraulic path having a plurality of bends; a cooling fan provided on the power input shaft to provide air flow directly to the outer surface of the cover member.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: May 29, 2007
    Assignee: Kubota Corporation
    Inventors: Takashi Shibata, Yoshio Tomiyama, Takashi Kuramoto, Hiroshi Shimada, Takeshi Komorida, Kenji Nishihara, Masashi Osuga
  • Publication number: 20070072430
    Abstract: A method of manufacturing a semiconductor device is disclosed that includes a semiconductor wafer having a main surface including a device chip area, a peripheral area encompassing the device chip area, and a blank area situated between the device chip area and the peripheral area. The method includes the steps of coating the entire main surface of the semiconductor wafer with a positive photosensitive resist, defining an additional exposure area in the blank area, conducting a first exposure process on the peripheral area and the additional exposure area, conducting a second exposure process on the device chip area, removing resist remaining on predetermined areas of the device chip area, the peripheral area and the blank area after conducting the first and second exposure processes for forming a resist pattern, and dry-etching the main surface of the semiconductor wafer by using the resist pattern as a mask.
    Type: Application
    Filed: September 22, 2006
    Publication date: March 29, 2007
    Inventors: Shouji Tochishita, Kenji Nishihara, Tohru Haruki, Tadao Uehara, Kiyotaka Ishibushi
  • Publication number: 20070023932
    Abstract: A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.
    Type: Application
    Filed: February 28, 2006
    Publication date: February 1, 2007
    Inventors: Koichi Sogawa, Kiyoshi Yano, Tohru Haruki, Hidetsugu Miyake, Shouji Tochishita, Minoru Ohtomo, Kenji Nishihara
  • Publication number: 20060283183
    Abstract: A hydrostatic continuously variable transmission comprises: a hydraulic pump; a power input shaft engaged with the hydraulic pump to transmit power from a power source to the hydraulic pump; a hydraulic motor in hydraulic communication with the hydraulic pump; a casing that houses the hydraulic pump and the hydraulic motor; a port block mounted to the casing, the port block having a block main body and a cover member connected to a power input side of the block main body, said cover member having an outer surface; a cooling hydraulic path provided in the port block in a region where the block main body and the cover member meet, the cooling hydraulic path being connected to a first hydraulic path in the port block, the cooling hydraulic path having a plurality of bends; a cooling fan provided on the power input shaft to provide air flow directly to the outer surface of the cover member.
    Type: Application
    Filed: March 15, 2006
    Publication date: December 21, 2006
    Applicant: Kubota Corporation
    Inventors: Takashi Shibata, Yoshio Tomiyama, Takashi Kuramoto, Hiroshi Shimada, Takeshi Komorida, Kenji Nishihara, Masashi Osuga
  • Publication number: 20060243505
    Abstract: An operating system for a tractor to which an implement is attachable, the operating system comprises: a steering wheel provided rearwardly of a hood that houses an engine located in a forward region of the tractor; a control panel provided rearwardly of the hood and adjacent the steering wheel; a center cover extending generally vertically below the steering wheel; an operation lever provided at a position laterally of the control panel; a valve unit with a pair of spools, the valve unit being located at a lower position with respect to the steering wheel and being covered by the center cover; a link mechanism that links the operation lever and the pair of spools, the link mechanism being covered by the center cover.
    Type: Application
    Filed: March 14, 2006
    Publication date: November 2, 2006
    Applicant: Kubota Corporation
    Inventors: Takashi Kuramoto, Masashi Osuga, Hiroshi Shimada, Yoshio Tomiyama, Takeshi Komorida, Hironobu Nishihara, Kenji Nishihara, Takashi Shibata