Abstract: An alignment apparatus of this invention includes a holding stage that is larger in size than a semiconductor wafer, and an optical sensor that optically detects a position of a peripheral edge of the semiconductor wafer placed on and suction-held by the holding stage. The holding stage has a slits formed thereon vertically in a circumferential direction, and an outer periphery of the semiconductor wafer lies on the slits. The optical sensor is of a transparent type and includes a projector and a photodetector opposed vertically to each other with the slit interposed therebetween. The optical sensor measures the peripheral edge of the semiconductor wafer on the slits of the holding stage.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alky ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: A multiple error processor in an automatic work handling apparatus includes controlling a number of operating mechanisms individually by the operation of control devices corresponding thereto. The operating mechanisms are controlled to stop for errors arising thereon according to stop mode data which corresponds to the errors. The operating mechanisms are controlled to restart-up according to restart-up data corresponding to a first generated error and also for ensuing errors occurring after the first error and before all of the operating mechanisms come to a stop. The errors are stored in an error code memory in an error recovery device.