Patents by Inventor Kenji Nulman

Kenji Nulman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for die stack flux removal
    Patent number: 11756805
    Abstract: A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 12, 2023
    Assignee: VEECO INSTRUMENTS INC.
    Inventors: John Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
  • High pressure spray head
    Patent number: 11420223
    Abstract: A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: August 23, 2022
    Assignee: VEECO INSTRUMENTS INC.
    Inventors: Steven Honigman, Kenji Nulman
  • APPARATUS AND METHOD FOR DIE STACK FLUX REMOVAL
    Publication number: 20210202272
    Abstract: A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.
    Type: Application
    Filed: December 10, 2020
    Publication date: July 1, 2021
    Inventors: John Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
  • Apparatus and method for wafer thinning in advanced packaging applications
    Patent number: 10541180
    Abstract: A system and method are provided for etching semiconductor wafers (integrated circuit substrates) with advanced packaging using a two-step wet etching process. The first etch step uses an etchant that is non-selective to at least the wafer material (silicon) and metals, such as copper and titanium, that are present in the wafer. The second etch step uses an etchant that is selective to the wafer material (silicon) and has low selectivity for the metals, thereby leaving them at least substantially intact.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: January 21, 2020
    Assignee: VEECO PRECISION SURFACE PROCESSING LLC
    Inventors: Laura Mauer, John Taddei, John Clark, Kenji Nulman
  • HIGH PRESSURE SPRAY HEAD
    Publication number: 20190381533
    Abstract: A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 19, 2019
    Inventors: Steven Honigman, Kenji Nulman
  • Apparatus and method to remove solids from material lift off post process solvents
    Patent number: 10413850
    Abstract: An apparatus and method for removing post MLO (Material Lift Off) materials from a recycle solvent stream utilize a space efficient design and in a fashion that greatly reduces equipment downtime to maintenance and in a health friendly fashion.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: September 17, 2019
    Assignee: VEECO PRECISION SURFACE PROCESSING LLC
    Inventors: John Taddei, Paul Vit, Kenji Nulman, Jim Anders
  • APPARATUS AND METHOD FOR WAFER THINNING IN ADVANCED PACKAGING APPLICATIONS
    Publication number: 20180254221
    Abstract: A system and method are provided for etching semiconductor wafers (integrated circuit substrates) with advanced packaging using a two-step wet etching process. The first etch step uses an etchant that is non-selective to at least the wafer material (silicon) and metals, such as copper and titanium, that are present in the wafer. The second etch step uses an etchant that is selective to the wafer material (silicon) and has low selectivity for the metals, thereby leaving them at least substantially intact.
    Type: Application
    Filed: February 23, 2018
    Publication date: September 6, 2018
    Inventors: Laura Mauer, John Taddei, John Clark, Kenji Nulman
  • APPARATUS AND METHOD TO REMOVE SOLIDS FROM MATERIAL LIFT OFF POST PROCESS SOLVENTS
    Publication number: 20180207562
    Abstract: An apparatus and method for removing post MLO (Material Lift Off) materials from a recycle solvent stream utilize a space efficient design and in a fashion that greatly reduces equipment downtime to maintenance and in a health friendly fashion.
    Type: Application
    Filed: January 18, 2018
    Publication date: July 26, 2018
    Inventors: John Taddei, Paul Vit, Kenji Nulman, Jim Anders
  • Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process
    Publication number: 20170287768
    Abstract: An apparatus and method to improve the plasma dicing and backmetal cleaving process on substrates through the use of pressurized deionized water (DI) dispense and specialized tooling.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Inventors: Laura Mauer, John Taddei, Kenji Nulman, Lev Rapoport, John Clark