Abstract: In a surge protection circuit in a three-phase four-wire circuit, a first three-phase three-wire surge module includes terminals respectively coupled to a first phase R, a second phase S, a third phase T, and a fifth phase E. A single-phase two-wire surge module includes terminals respectively coupled to one phase R among the first phase R, the second phase S, and the third phase T, to a fourth phase N, and to the fifth phase E. The second three-phase three-wire surge module includes terminals respectively coupled to the two phases S and T among the first phase R, the second phase S, and the third phase T, to the fourth phase N, and to the fifth phase E. The two phases S and T are not coupled to the single-phase two-wire surge module.

Abstract: The electrochemical cell of the present invention is provided with a hermetic container having a base member, a jointing material fixed to the base member, and a lid member welded on the base member via the jointing material, and in which a housing space sealed between the base member and the lid member is defined, and an electrochemical element which is housed inside the housing space and which is available to effect charging and discharging, wherein the lid member is made of stainless steel.

Abstract: The electrochemical cell of the present invention is provided with a hermetic container having a base member, a jointing material fixed to the base member, and a lid member welded on the base member via the jointing material, and in which a housing space sealed between the base member and the lid member is defined, and an electrochemical element which is housed inside the housing space and which is available to effect charging and discharging, wherein the lid member is made of stainless steel.

Abstract: An optical transmission/reception module including a filter holder on which filter mount surfaces for mounting wavelength division multiplexing filters and light wavelength band limiting filters are formed and in which a hole for guiding a light signal is formed in each of the filter mount surfaces incorporated into a housing. The wavelength division multiplexing filters and the light wavelength band limiting filters are mounted to the filter mount surfaces formed on the filter holder, respectively.

Abstract: A gas engine system has a control unit including: a first determination section for determining, as a first determination, whether the gas pressure is a low pressure less than a predetermined pressure, while the control device recognizes the gas valve is closed; a second determination section for determining, as a second determination, whether the gas pressure is a high pressure equal to or more than the predetermined pressure, while the control device recognizes that the gas valve is open, if the first determination determines the gas pressure is the low pressure; a start-up section for performing the first and second determinations before start of engine operation when receiving a start-up command; and an operation start section for opening the valve and starting the engine, if the first determination determines the gas pressure is the low pressure, and if the second determination determines the pressure is the high pressure.

Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.

Abstract: In a surge protection circuit in a three-phase four-wire circuit, a first three-phase three-wire surge module includes terminals respectively coupled to a first phase R, a second phase S, a third phase T, and a fifth phase E. A single-phase two-wire surge module includes terminals respectively coupled to one phase R among the first phase R, the second phase S, and the third phase T, to a fourth phase N, and to the fifth phase E. The second three-phase three-wire surge module includes terminals respectively coupled to the two phases S and T among the first phase R, the second phase S, and the third phase T, to the fourth phase N, and to the fifth phase E. The two phases S and T are not coupled to the single-phase two-wire surge module.

Abstract: An optical transmission/reception module including a filter holder on which filter mount surfaces for mounting wavelength division multiplexing filters and light wavelength band limiting filters are formed and in which a hole for guiding a light signal is formed in each of the filter mount surfaces incorporated into a housing. The wavelength division multiplexing filters and the light wavelength band limiting filters are mounted to the filter mount surfaces formed on the filter holder, respectively.

Abstract: A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: There are provided a first mold 2 and a second mold 1 that can be brought into and released from contact with the first mold 2. A substrate 70 provided in both the molds 1, 2 and mounted with electronic components is subjected to resin sealing and molding by filling with resin of cavities formed by both the molds 1, 2. The second mold 1 is placed on a base plate 9 so as to be capable of horizontally reciprocating, and has a cavity block 7 that can be brought into and released from contact with the first mold 2 and a mold clamping mechanism 16 that supports the cavity block 7 and that brings and releases the cavity block 7 into and from contact with the first mold 2 so as to perform mold clamping. On the base plate 9 is provided a horizontal actuation mechanism 11 for moving the second mold 1 to a facing position where the second mold 1 faces the first mold 2 and to a non-facing position where the second mold 1 has been moved sideways from the facing position.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: The Anti Ant Pet Food Bowl is unique because it has a water trough encircling the bottom of the bowl. Placing water in the trough prevents ants and any insects and bugs from reaching the food in the bowl.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: To reduce damaging of an inner tube in the vicinity of a gas ejection port of an inflator. To the peripheral portion near an end on a gas ejection port side of an inflator, one end of a pipe is fixed. The pipe extends in the axial direction of an inner tube having such flexibility as a cloth, is smaller in the diameter, shorter and higher in rigidity than the inner tube. In the pipe, its leading end is thinner than a part that is an outer portion of the gas ejection port of the inflator. Further, at the peripheral portion of the end of the pipe, a rear-leading end of the inner tube is clamped by a clamp.

Abstract: A secondary battery or capacitor fitted with terminals and occupies less area on a packaging substrate. Either one of the positive and negative terminals is mounted within the outer surface of the secondary battery or capacitor. This reduces the area occupied by the secondary battery or capacitor fitted with terminals on the substrate. At least one step is formed on the terminal positioned opposite to the substrate. This prevents electrical shorting between the positive electrode can and the negative terminal.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).