Patents by Inventor Kenji Ohki

Kenji Ohki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11752734
    Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: September 12, 2023
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko Sugiura, Issei Okada, Kenji Ohki
  • Patent number: 11013113
    Abstract: According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 ?m.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: May 18, 2021
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko Sugiura, Issei Okada, Takashi Kasuga, Yoshio Oka, Kenji Ohki
  • Publication number: 20210022245
    Abstract: According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 ?m.
    Type: Application
    Filed: September 24, 2018
    Publication date: January 21, 2021
    Inventors: Motohiko SUGIURA, Issei OKADA, Takashi KASUGA, Yoshio OKA, Kenji OHKI
  • Publication number: 20200324517
    Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.
    Type: Application
    Filed: September 24, 2018
    Publication date: October 15, 2020
    Inventors: Motohiko SUGIURA, Issei OKADA, Kenji OHKI
  • Patent number: 10796812
    Abstract: A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 6, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko Sugiura, Issei Okada, Yoshio Oka, Atsushi Kimura, Kenji Ohki
  • Patent number: 10610928
    Abstract: A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: April 7, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Issei Okada, Motohiko Sugiura, Yoshio Oka, Kenji Ohki
  • Publication number: 20190077974
    Abstract: A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.
    Type: Application
    Filed: March 14, 2017
    Publication date: March 14, 2019
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko SUGIURA, Issei OKADA, Yoshio OKA, Atsushi KIMURA, Kenji OHKI
  • Publication number: 20190054524
    Abstract: A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
    Type: Application
    Filed: September 27, 2016
    Publication date: February 21, 2019
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Issei OKADA, Motohiko SUGIURA, Yoshio OKA, Kenji OHKI
  • Publication number: 20180315519
    Abstract: A coating liquid for forming a conductive layer according to an embodiment of the present invention contains fine metal particles, a dispersion medium, and a dispersant. The coating liquid has a pH of 4 or more and 8 or less, an electrical conductivity of 100 ?S/cm or more and 800 ?S/cm or less, and a content of the fine metal particles of 20% by mass or more and 80% by mass or less. A method for manufacturing a conductive layer according to another embodiment of the present invention is a method for manufacturing a conductive layer using a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersion medium, and a dispersant. The method includes an application step of applying the coating liquid for forming a conductive layer, and a heating step of heating the coating liquid for forming a conductive layer after application.
    Type: Application
    Filed: September 27, 2016
    Publication date: November 1, 2018
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Motohiko SUGIURA, Issei OKADA, Yoshio OKA, Kenji OHKI
  • Publication number: 20180305829
    Abstract: A method for manufacturing a titanium trichloride solution according to an embodiment of the present invention is a method for manufacturing a titanium trichloride solution, the method including reducing titanium tetrachloride in an electrolyte solution by using an ion-exchange electrolytic reduction method. In the method, an aqueous solution containing sulfate ions is used as an electrolyte solution on the anode side. A device for manufacturing a titanium trichloride solution according to another embodiment of the present invention is a device for manufacturing a titanium trichloride solution by electrolytic reduction of titanium tetrachloride in an aqueous solution.
    Type: Application
    Filed: October 4, 2016
    Publication date: October 25, 2018
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Issei OKADA, Motohiko SUGIURA, Yoshio OKA, Kenji OHKI
  • Patent number: 8634136
    Abstract: There is provided a screen that, as a screen suitable for an interactive board, can output video image light incident obliquely from the back surface side to a viewer side to display a reflection-free image and, at the same time, can realize easy handwriting on the screen surface on the viewer side. To this end, a transmission screen for an interactive board is provided that comprises at least a Fresnel lens sheet comprising a prism part on its incident light side, a light diffusing member provided on the Fresnel lens on its surface side remote from the prism part, and a hard coat layer provided on the outgoing light side of the light diffusing member.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: January 21, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazunobu Ogawa, Takeshi Ogawa, Kenji Ohki, Tetsuya Sadahiro
  • Publication number: 20110122493
    Abstract: There is provided a screen that, as a screen suitable for an interactive board, can output video image light incident obliquely from the back surface side to a viewer side to display a reflection-free image and, at the same time, can realize easy handwriting on the screen surface on the viewer side. To this end, a transmission screen for an interactive board is provided that comprises at least a Fresnel lens sheet comprising a prism part on its incident light side, a light diffusing member provided on the Fresnel lens on its surface side remote from the prism part, and a hard coat layer provided on the outgoing light side of the light diffusing member.
    Type: Application
    Filed: March 25, 2010
    Publication date: May 26, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Kazunobu Ogawa, Takeshi Ogawa, Kenji Ohki, Tetsuya Sadahiro
  • Patent number: 7307290
    Abstract: A compound semiconductor wafer providing an InGaAs light receiving layer having superior crystal characteristic suitable for a near-infrared sensor includes an InAsxP1-x graded buffer layer consisting of a plurality of layers positioned on an InP substrate and an InAsyP1-y buffer layer positioned on the graded buffer layer, sandwiched between said InP substrate and the InGaAs layer, wherein maximum value of PL light emission intensity at an interface of each of the layers of the graded buffer layer and the buffer layer is, at every interface, smaller than 3/10 of the maximum PL light emission intensity of the buffer layer.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: December 11, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Iwasaki, Shigeru Sawada, Hiroya Kimura, Kenji Ohki
  • Publication number: 20050242372
    Abstract: A compound semiconductor wafer providing an InGaAs light receiving layer having superior crystal characteristic suitable for a near-infrared sensor includes an InAsxP1-x graded buffer layer consisting of a plurality of layers positioned on an InP substrate and an InAsyP1-y buffer layer positioned on the graded buffer layer, sandwiched between said InP substrate and the InGaAs layer, wherein maximum value of PL light emission intensity at an interface of each of the layers of the graded buffer layer and the buffer layer is, at every interface, smaller than 3/10 of the maximum PL light emission intensity of the buffer layer.
    Type: Application
    Filed: April 13, 2004
    Publication date: November 3, 2005
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Takashi Iwasaki, Shigeru Sawada, Hiroya Kimura, Kenji Ohki
  • Patent number: 6835990
    Abstract: A semiconductor light receiving element has a semiconductor portion. The semiconductor portion includes a substrate, a light detecting portion, and a filter portion. The substrate, the light detecting portion, and the filter portion are provided sequentially in a direction of a predetermined axis. The light detecting portion has a light absorbing layer including a III-V semiconductor layer, a window layer including a III-V semiconductor layer, and an anode semiconductor region. The light absorbing layer is an n or i conductivity type semiconductor layer. The light absorbing layer is provided between a III-V semiconductor layer and the window layer. The light detecting portion is provided on one face of the semiconductor substrate with the III-V semiconductor layer interposed therebetween. The filter portion includes InGaAsP semiconductor layers and III-V semiconductor layers.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: December 28, 2004
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yasuhiro Iguchi, Akira Yamaguchi, Manabu Shiozaki, Takashi Iwasaki, Kenji Ohki
  • Publication number: 20030151057
    Abstract: A semiconductor light receiving element has a semiconductor portion. The semiconductor portion includes a substrate, a light detecting portion, and a filter portion. The substrate, the light detecting portion, and the filter portion are provided sequentially in a direction of a predetermined axis. The light detecting portion has a light absorbing layer including a III-V semiconductor layer, a window layer including a III-V semiconductor layer, and an anode semiconductor region. The light absorbing layer is an n or i conductivity type semiconductor layer. The light absorbing layer is provided between a III-V semiconductor layer and the window layer. The light detecting portion is provided on one face of the semiconductor substrate with the III-V semiconductor layer interposed therebetween. The filter portion includes InGaAsP semiconductor layers and III-V semiconductor layers.
    Type: Application
    Filed: February 7, 2003
    Publication date: August 14, 2003
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yasuhiro Iguchi, Akira Yamaguchi, Manabu Shiozaki, Takashi Iwasaki, Kenji Ohki
  • Patent number: 4414255
    Abstract: A water-absorbing sheet assembly comprises two sheets, at least one of which is a water-permeable sheet, and a polymeric absorbent inserted between said two sheets, wherein at least a part of said two sheets are pressed and bonded to each other.
    Type: Grant
    Filed: April 18, 1980
    Date of Patent: November 8, 1983
    Assignee: Kao Soap Co., Ltd.
    Inventors: Mitsuru Tokuyama, Yoshimi Tsuchiya, Hikotaro Kawaguchi, Masayuki Sagae, Kenji Ohki
  • Patent number: 4364985
    Abstract: A porous sheet is disclosed that comprises a thin, flexible sheet made of thermoplastic resin having solid particles distributed therein. Small spaces are formed around the particles, such that abrasion or buffing of the opposite surfaces of the sheet causes the formation of a multitude of fine pores that extend through the sheet, making the sheet vapor-permeable but liquid-impermeable.
    Type: Grant
    Filed: May 29, 1981
    Date of Patent: December 21, 1982
    Assignee: Kao Soap Co., Ltd.
    Inventors: Mitsuru Tokuyama, Kenji Ohki, Masayuki Sagae, Kaoru Tsujii
  • Patent number: 4347844
    Abstract: A porous sheet comprising a flexible sheet in which a rigid substance is incorporated, wherein pores are formed in the sheet by breaking the rigid substance.
    Type: Grant
    Filed: December 29, 1980
    Date of Patent: September 7, 1982
    Assignee: Kao Soap Co., Ltd.
    Inventors: Kenji Ohki, Mistru Tokuyama, Masayuki Sagae, Kenji Kawabuchi