Abstract: There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrate 3 includes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film 7) is formed to increase strength of the wiring pattern.

Abstract: There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate 3 and a semiconductor device 1 and an insertion substrate 18 which are arranged on the substrate 3. The interposer substrate 3 includes a wiring pattern 6 therein. A gap 8 is formed between the semiconductor device 1 and the insertion substrate 18; in an area corresponding to the gap, a reinforcing member (a metallic film 7) is formed to increase strength of the wiring pattern 6.