Patents by Inventor Kenji Okatani

Kenji Okatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputtering apparatus and film forming method
    Patent number: 7156961
    Abstract: The present invention is to provide a sputtering apparatus and a thin film formation method which make it possible to form respective layers of a multilayer film having a clean interface at a optimum temperature, or which make it possible to continuously carry out the film formation and the surface processing. Another object of this invention is to provide a small sputtering apparatus for forming a multilayer film as compared with prior art apparatus. A sputtering apparatus of this invention comprises a main shaft around which at least one target and at least one surface processing mechanism are installed, a substrate holder holding a substrate or a plurality of substrates arranged facing the target and the surface processing mechanism, and a rotation mechanism to rotate the main shaft or the substrate holder.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: January 2, 2007
    Assignee: Anelva Corporation
    Inventors: Kenji Okatani, Satoshi Yamada, Yoshiro Hasegawa
  • Sputtering apparatus and film forming method
    Publication number: 20030079984
    Abstract: The present invention is to provide a sputtering apparatus and a thin film formation method which make it possible to form respective layers of a multilayer film having a clean interface at a optimum temperature, or which make it possible to continuously carry out the film formation and the surface processing. Another object of this invention is to provide a small sputtering apparatus for forming a multilayer film as compared with prior art apparatus. A sputtering apparatus of this invention comprises a main shaft around which at least one target and at least one surface processing mechanism are installed, a substrate holder holding a substrate or a plurality of substrates arranged facing the target and the surface processing mechanism, and a rotation mechanism to rotate the main shaft or the substrate holder.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 1, 2003
    Inventors: Kenji Okatani, Satoshi Yamada, Yoshiro Hasegawa