Abstract: A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

Abstract: A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

Abstract: A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

Abstract: A hybrid vehicle includes: an engine configured to output power for traveling; a motor configured to output power for traveling; a switch configured to set a fuel economy priority mode, in which priority is given to fuel economy, and to cancel the fuel economy priority mode; and a controller configured (a) to operate the engine and the motor based on the switch setting; (b) to determine the presence/absence of degradation of fuel supplied to the engine; and (c) to prohibit setting of the fuel economy priority mode by the switch subsequently when determination is made that the fuel has degraded when the hybrid vehicle travels using power of the motor in a state in which the drive of the engine is stopped.

Abstract: A control apparatus for a hybrid vehicle includes an engine for traveling, a motor for traveling, and a battery exchanging electric power with the motor. the control apparatus including: a heater is configured to perform heating inside a cabin of the hybrid vehicle by using the engine or an electric heat source as a heat source; and a controller is configured to operate the engine intermittently, the controller is configured to select the heat source for the heater, the controller is configured to determine whether or not a fuel for the engine is degraded when the engine is stopped, and the controller is configured to start the engine and select the engine as the heat source when the controller determines that the fuel is degraded.

Abstract: The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

Abstract: An object of the present invention is to provide a thermosetting die-bonding film having both storage modulus and high adhering strength that are necessary in manufacturing a semiconductor device and to provide a dicing die-bonding film including the thermosetting die-bonding film. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used in manufacture of a semiconductor device and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, has a storage modulus at 80 to 140° C. before thermal curing in a range of 10 kPa to 10 MPa and a storage modulus at 175° C. before thermal curing in a range of 0.1 to 3 MPa.

Abstract: The present invention provides a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element and that enables loading of the other semiconductor element and improvement in the manufacturing yield of a semiconductor device by preventing deformation and cutting of the bonding wire, and a dicing die bond film. The die bond film of the present invention is a die bond film for adhering, onto a semiconductor element that is electrically connected to an adherend with a bonding wire, another semiconductor element, in which at least a first adhesive layer that enables a portion of the bonding wire to pass through inside thereof by burying the portion upon press bonding and a second adhesive layer that prevents the other semiconductor element from contacting with the bonding wire are laminated.

Abstract: An ECU releases brake hold control when an actual accelerator pedal position A exceeds a predetermined position A(0) while the brake hold control is being executed. Further, the ECU determines whether or not the actual accelerator pedal position A is larger than a position A(1), which is a value smaller than the predetermined position A(0), and if it is larger than the predetermined position A(1), executes a process for increasing a creep torque reflection ratio R to recover creep force that has been stopped.

Abstract: Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.

Abstract: The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 ?m.

Abstract: An object of the present invention is to provide a thermosetting die-bonding film with which a die-bonding film is suitably broken with a tensile force. The object is achieved by a thermosetting die-bonding, film at least having an adhesive layer that is used to fix a semiconductor chip to an adherend, in which the breaking energy per unit area is 1 J/mm2 or less and the elongation at break is 40% or more to 500% or less at room temperature before thermal setting.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface is formed of a resin composition containing a thermosetting resin component and, as an optional component, a thermoplastic resin component in an amount of less than 50% by weight relative to the whole amount of resin components.

Abstract: An ECU releases brake hold control when an actual accelerator pedal position A exceeds a predetermined position A(0) while the brake hold control is being executed. Further, the ECU determines whether or not the actual accelerator pedal position A is larger than a position A(1), which is a value smaller than the predetermined position A(0), and if it is larger than the predetermined position A(1), executes a process for increasing a creep torque reflection ratio R to recover creep force that has been stopped.

Abstract: A semiconductor integrated circuit with stabilizing capacity has a voltage drop circuit that drops a power supply voltage to a first voltage Vcc1 and supplies the Vcc1 to a plurality of function blocks; a stabilizing capacity that stabilizes the Vcc1; and a plurality of voltage switching circuits each of which is provided in each of the function blocks and selectively switches between the Vcc1 and a base voltage Vss to produce a second voltage Vcc2 and supplies the Vcc2 to each function block, and each of the function blocks forms a capacity for stabilizing an output of the voltage drop circuit by means of its semiconductor structure by the Vcc1 and the Vcc2 applied thereto.

Abstract: A semiconductor integrated circuit with stabilizing capacity has a voltage drop circuit that drops a power supply voltage to a first voltage Vcc1 and supplies the Vcc1 to a plurality of function blocks; a stabilizing capacity that stabilizes the Vcc1; and a plurality of voltage switching circuits each of which is provided in each of the function blocks and selectively switches between the Vcc1 and a base voltage Vss to produce a second voltage Vcc2 and supplies the Vcc2 to each function block, and each of the function blocks forms a capacity for stabilizing an output of the voltage drop circuit by means of its semiconductor structure by the Vcc1 and the Vcc2 applied thereto.

Abstract: For obtaining a central processing unit to perform, with the same operation code, an operation in which a carry input is effective and an operation in which the carry input is invalid or an operation in which a borrow input is effective and an operation in which the borrow input is invalid, between an output of a carry and borrow flag and a carry and borrow input of an ALU there is provided a switching circuit to switch the input of the ALU by a control signal different from a control signal of the central processing unit due to an operation code.