Patents by Inventor Kenji Ootomo

Kenji Ootomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting electronic components on a circuit board
    Patent number: 5283947
    Abstract: Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).
    Type: Grant
    Filed: February 10, 1993
    Date of Patent: February 8, 1994
    Assignee: Matsushita Electric Industrial Co., Inc.
    Inventors: Kouichi Santo, Kouji Tanabe, Naohiro Nishioka, Kenji Ootomo, Yoshihito Okazaki