Abstract: It is an object of the present invention to provide a method for producing frozen mesenchymal cells maintaining a viability and an adhesion rate similar to those of cells obtained through a step of culture, without undergoing a step of culturing cells before cryopreservation step. The method comprises dissociating cells by treating a tissue with proteolytic enzymes and cryopreserving the cells. The present invention provides a method for producing frozen mesenchymal cells maintaining a viability and an adhesion rate similar to those of culturing cells without a step of culturings cells before cryopreserving.

Abstract: It is an object of the present invention to provide a method for producing frozen mesenchymal cells maintaining a viability and an adhesion rate similar to those of cells obtained through a step of culture, without undergoing a step of culturing cells before cryopreservation step. The method comprises dissociating cells by treating a tissue with proteolytic enzymes and cryopreserving the cells. The present invention provides a method for producing frozen mesenchymal cells maintaining a viability and an adhesion rate similar to those of culturing cells without a step of culturings cells before cryopreserving.

Abstract: It is intended to provide an optical disk apparatus which detects a light amount greater than zero even when used in conjunction with an optical disk substrate having a large birefringence, so that it is possible to properly read a signal without errors and properly perform optical disk controls. The optical disk apparatus includes: a light source for emitting light; an objective lens for converging the light onto a signal surface of an optical disk; a polarized beam diffraction element for diffracting the light reflected from the optical disk; a photodetector for detecting the light diffracted from the polarized beam diffraction element; and a wavelength plate disposed between the optical disk and the polarized beam diffraction element.

Abstract: It is intended to provide an optical disk apparatus which detects a light amount greater than zero even when used in conjunction with an optical disk substrate having a large birefringence, so that it is possible to properly read a signal without errors and properly perform optical disk controls. The optical disk apparatus includes: a light source for emitting light; an objective lens for converging the light onto a signal surface of an optical disk; a polarized beam diffraction element for diffracting the light reflected from the optical disk; a photodetector for detecting the light diffracted from the polarized beam diffraction element; and a wavelength plate disposed between the optical disk and the polarized beam diffraction element.

Abstract: The invention provides a differential current output unit that has a least number of capacitors and a minimized chip area on one hand, and on the other hand that is capable of providing a smoothly varying output current across a zero-crossing point in accord with an inputted difference input voltage. To do this, the differential current output unit is entirely formed of differential circuits and current mirror circuits having predetermined current mirror ratios. Thus, the unit has a stable output current characteristic. The unit has an inflow output transistor circuit and an outflow output transistor circuit that are operably separated by a delivery circuit. Thus, no penetration current will flow through the inflow- and outflow-output transistor circuits.

Abstract: To minimize distance from a power supply or ground line of a semiconductor integrated circuit of a semiconductor device to electrodes of a printed board, a power supply electrode or ground line of the semiconductor integrated circuit is connected to a metal film through openings provided in a protective film over the power supply electrode. The structure comprising the deposited protective film and exposed metal film also allow radiation of heat through a minimized heat radiation path. The metal film is exposed to a printed board or exposed on the opposite side of the device, and the metal film is connected to a power supply or ground electrode of the printed board through its exposed surface. Alternatively, connected upper and lower metal films, with a stress relief film interposed, may be disposed in place of the metal film, or a metal sheet may be disposed over the metal film.

Abstract: A method of fabricating a semiconductor integrated circuit device is provided. The device includes a protection circuit that connects to a terminal and has a protection diode and a current mirror circuit. The current mirror circuit includes first and second transistors having bases thereof connected together and emitters thereof connected together, so that emitters are connected to an anode of the protection diode. A method includes forming the anode of the protection diode; forming a cathode of the protection diode to surround the anode; forming a collector of the first transistor to surround about a half of the anode within a region surrounded by the cathode; forming a collector of the second transistor to surround about another half of the anode; and forming the bases of the first and second transistors as a common base substantially parallel to an edge of the collectors of the first and second transistors.

Abstract: In order to minimize a distance from a power supply line and/or a ground line of a semiconductor integrated circuit of a semiconductor device to electrodes of a printed board, at least either a power supply electrode or the ground line of the semiconductor integrated circuit is connected to a metal film through openings provided in a protective film over the power supply electrode. The metal film is exposed on a side of the semiconductor device, adjacent to a printed board on which the semiconductor device is mounted, or on a side thereof, opposite from the printed board, and the metal film is connected a power supply electrode and/or a ground electrode of the printed board through the exposed surface of the metal film. Alternatively, upper and lower metal films connected to each other, with a stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet may be disposed over the metal film.

Abstract: A power supply unit (system power supply IC) has a multiplicity of power supply circuits providing for different supply voltages. Should an abnormal condition take place in any of the multiple power supply circuits, the power supply circuit suffering the abnormality issues an abnormality detection signal that contains a power supply circuit number and an abnormality type, which signal is stored in a nonvolatile memory together with time data indicative of the time of reception of the abnormality detection signal before all the power supply circuits are disabled. Thus, this arrangement protects the system power supply IC and the loads connected thereto, and provides convenient means for analyzing the abnormality and replicating it if necessary, based on the abnormal power supply circuit number, abnormality type and time data stored in the nonvolatile memory.

Abstract: The invention provides a differential current output unit that has a least number of capacitors and a minimized chip area on one hand, and on the other hand that is capable of providing a smoothly varying output current across a zero-crossing point in accord with an inputted difference input voltage. To do this, the differential current output unit is entirely formed of differential circuits and current mirror circuits having predetermined current mirror ratios. Thus, the unit has a stable output current characteristic. The unit has an inflow output transistor circuit and an outflow output transistor circuit that are operably separated by a delivery circuit. Thus, no penetration current will flow through the inflow- and outflow-output transistor circuits.

Abstract: The invention provides a differential current output unit that has a least number of capacitors and a minimized chip area on one hand, and on the other hand that is capable of providing a smoothly varying output current across a zero-crossing point in accord with an inputted difference input voltage. To do this, the differential current output unit is entirely formed of differential circuits and current mirror circuits having predetermined current mirror ratios. Thus, the unit has a stable output current characteristic. The unit has an inflow output transistor circuit and an outflow output transistor circuit that are operably separated by a delivery circuit. Thus, no penetration current will flow through the inflow- and outflow-output transistor circuits.

Abstract: It is intended to provide an optical disk apparatus which detects a light amount greater than zero even when used in conjunction with an optical disk substrate having a large birefringence, so that it is possible to properly read a signal without errors and properly perform optical disk controls. The optical disk apparatus includes: a light source for emitting light; an objective lens for converging the light onto a signal surface of an optical disk; a polarized beam diffraction element for diffracting the light reflected from the optical disk; a photodetector for detecting the light diffracted from the polarized beam diffraction element; and a wavelength plate disposed between the optical disk and the polarized beam diffraction element.

Abstract: To a plurality of terminals are connected, one to one, a plurality of current mirror circuits each having a first load portion through which a first current flows when an overvoltage is applied and a second load portion through which a second current proportional to the first current flows. The first load portion of the current mirror circuit connected to one of the plurality of terminals is shared as the first load portions of the current mirror circuits connected to the others of the plurality of terminals. The shared first load portion includes an overvoltage protection circuit. The second load portions of the current mirror circuits connected to the plurality of terminals each include an overvoltage detection circuit for detecting the second current.

Abstract: In order to minimize a distance from a power supply line and/or a ground line of a semiconductor integrated circuit of a semiconductor device to electrodes of a printed board, at least either a power supply electrode or the ground line of the semiconductor integrated circuit is connected to a metal film through openings provided in a protective film over the power supply electrode. The metal film is exposed on a side of the semiconductor device, adjacent to a printed board on which the semiconductor device is mounted, or on a side thereof, opposite from the printed board, and the metal film is connected a power supply electrode and/or a ground electrode of the printed board through the exposed surface of the metal film. Alternatively, upper and lower metal films connected to each other, with a stress relief film interposed therebetween, may be disposed in place of the metal film, or a metal sheet may be disposed over the metal film.

Abstract: To a plurality of terminals are connected, one to one, a plurality of current mirror circuits each having a first load portion through which a first current flows when an overvoltage is applied and a second load portion through which a second current proportional to the first current flows. The first load portion of the current mirror circuit connected to one of the plurality of terminals is shared as the first load portions of the current mirror circuits connected to the others of the plurality of terminals. The shared first load portion includes an overvoltage protection circuit. The second load portions of the current mirror circuits connected to the plurality of terminals each include an overvoltage detection circuit for detecting the second current.

Abstract: The invention provides a differential current output unit that has a least number of capacitors and a minimized chip area on one hand, and on the other hand that is capable of providing a smoothly varying output current across a zero-crossing point in accord with an inputted difference input voltage. To do this, the differential current output unit is entirely formed of differential circuits and current mirror circuits having predetermined current mirror ratios. Thus, the unit has a stable output current characteristic. The unit has an inflow output transistor circuit and an outflow output transistor circuit that are operably separated by a delivery circuit. Thus, no penetration current will flow through the inflow- and outflow-output transistor circuits.

Abstract: In a semiconductor integrated circuit device, a reference voltage is connected to one input terminal of an amplifier, and the voltage appearing on the output side is divided by a plurality of resistors and is negatively fed back to the other input terminal of the amplifier to control the output voltage. Here, according to an input code fed to the semiconductor integrated circuit device, switching devices are turned on or off correspondingly to vary how the resistors are connected and thereby control the voltage division factor. Thus, the output voltage is set according to the input code.

Abstract: A power supply unit (system power supply IC) has a multiplicity of power supply circuits providing for different supply voltages. Should an abnormal condition take place in any of the multiple power supply circuits, the power supply circuit suffering the abnormality issues an abnormality detection signal that contains a power supply circuit number and an abnormality type, which signal is stored in a nonvolatile memory together with time data indicative of the time of reception of the abnormality detection signal before all the power supply circuits are disabled. Thus, this arrangement protects the system power supply IC and the loads connected thereto, and provides convenient means for analyzing the abnormality and replicating it if necessary, based on the abnormal power supply circuit number, abnormality type and time data stored in the nonvolatile memory.

Abstract: In a semiconductor integrated circuit device, a reference voltage is connected to one input terminal of an amplifier, and the voltage appearing on the output side is divided by a plurality of resistors and is negatively fed back to the other input terminal of the amplifier to control the output voltage. Here, according to an input code fed to the semiconductor integrated circuit device, switching devices are turned on or off correspondingly to vary how the resistors are connected and thereby control the voltage division factor. Thus, the output voltage is set according to the input code.

Abstract: To a plurality of terminals are connected, one to one, a plurality of current mirror circuits each having a first load portion through which a first current flows when an overvoltage is applied and a second load portion through which a second current proportional to the first current flows. The first load portion of the current mirror circuit connected to one of the plurality of terminals is shared as the first load portions of the current mirror circuits connected to the others of the plurality of terminals. The shared first load portion includes an overvoltage protection circuit. The second load portions of the current mirror circuits connected to the plurality of terminals each include an overvoltage detection circuit for detecting the second current.