Patents by Inventor Kenji Saruta

Kenji Saruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10583568
    Abstract: A workpiece conveying device includes a traveling platform which moves on traveling rails, a workpiece sucker arranged below the traveling platform, a vertical drive guide which is provided on the traveling platform and vertically drives the workpiece sucker, and a fork which is placed on the workpiece sucker so as to sandwich the workpiece sucker. With this structure, effects are obtained such that the workpiece conveying device is capable of achieving space saving in a factory and is capable of improving moving accuracy and increasing a moving speed while making it difficult to damage a product.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: March 10, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kunihiro Tanahashi, Kenji Saruta, Motohiko Hirao
  • Patent number: 10543601
    Abstract: A workpiece conveying device includes a traveling platform which moves on traveling rails, a workpiece sucker arranged below the traveling platform, a vertical drive guide which is provided on the traveling platform and vertically drives the workpiece sucker, and a fork which is placed on the workpiece sucker so as to sandwich the workpiece sucker. With this structure, effects are obtained such that the workpiece conveying device is capable of achieving space saving in a factory and is capable of improving moving accuracy and increasing a moving speed while making it difficult to damage a product.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: January 28, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kunihiro Tanahashi, Kenji Saruta, Motohiko Hirao
  • Publication number: 20190240846
    Abstract: A workpiece conveying device includes a traveling platform which moves on traveling rails, a workpiece sucker arranged below the traveling platform, a vertical drive guide which is provided on the traveling platform and vertically drives the workpiece sucker, and a fork which is placed on the workpiece sucker so as to sandwich the workpiece sucker. With this structure, effects are obtained such that the workpiece conveying device is capable of achieving space saving in a factory and is capable of improving moving accuracy and increasing a moving speed while making it difficult to damage a product.
    Type: Application
    Filed: October 27, 2016
    Publication date: August 8, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kunihiro TANAHASHI, Kenji SARUTA, Motohiko HIRAO
  • Patent number: 9687938
    Abstract: A laser machining apparatus includes: an optical-scanning laser machining device that includes a machining head, which moves in a first direction and a second direction intersecting the first direction and emits laser light on a workpiece to machine the workpiece; a first marking device that is provided on one side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; a second marking device that is provided on another side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; and a pallet on which the workpiece to be machined by the optical-scanning laser machining device is loaded and which moves in the first direction between the first marking device and the second marking device.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: June 27, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kunihiro Tanahashi, Kenji Saruta, Yuuki Tamura, Komaki Sasaki
  • Publication number: 20160250718
    Abstract: A laser machining apparatus includes: an optical-scanning laser machining device that includes a machining head, which moves in a first direction and a second direction intersecting the first direction and emits laser light on a workpiece to machine the workpiece; a first marking device that is provided on one side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; a second marking device that is provided on another side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; and a pallet on which the workpiece to be machined by the optical-scanning laser machining device is loaded and which moves in the first direction between the first marking device and the second marking device.
    Type: Application
    Filed: September 3, 2014
    Publication date: September 1, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kunihiro TANAHASHI, Kenji SARUTA, Yuuki TAMURA, Komaki SASAKI
  • Publication number: 20160238839
    Abstract: A laser processing device including: a laser oscillator; a processing table; a transmission optical system for transmitting laser light emitted from the laser oscillator to the processing table; a processing head for condensing and radiating the laser light transmitted via the transmission optical system to an object to be processed; a moving mechanism for changing a relative position between the object to be processed and the laser light to be radiated to the object to be processed; and a variable curvature spherical mirror. The transmission optical system includes a reflective beam expander mechanism for collimating and magnifying the laser light from the laser oscillator. The reflective beam expander mechanism includes a spherical mirror and a concave mirror having different curvatures in two orthogonal axes.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naoyuki NAKAMURA, Tatsuya YAMAMOTO, Junichi NISHIMAE, Shuichi FUJIKAWA, Masaki SEGUCHI, Akinori NISHIO, Hiroyuki MURAI, Kenji SARUTA
  • Patent number: 9348138
    Abstract: A laser processing device including: a laser oscillator; a processing table; a transmission optical system for transmitting laser light emitted from the laser oscillator to the processing table; a processing head for condensing and radiating the laser light transmitted via the transmission optical system to an object to be processed; a moving mechanism for changing a relative position between the object to be processed and the laser light to be radiated to the object to be processed; and a variable curvature spherical mirror. The transmission optical system includes a reflective beam expander mechanism for collimating and magnifying the laser light from the laser oscillator. The reflective beam expander mechanism includes a spherical mirror and a concave mirror having different curvatures in two orthogonal axes.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: May 24, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naoyuki Nakamura, Tatsuya Yamamoto, Junichi Nishimae, Shuichi Fujikawa, Masaki Seguchi, Akinori Nishio, Hiroyuki Murai, Kenji Saruta
  • Publication number: 20150137004
    Abstract: A laser processing device including: a laser oscillator; a processing table; a transmission optical system for transmitting laser light emitted from the laser oscillator to the processing table; a processing head for condensing and radiating the laser light transmitted via the transmission optical system to an object to be processed; a moving mechanism for changing a relative position between the object to be processed and the laser light to be radiated to the object to be processed; and a variable curvature spherical mirror. The transmission optical system includes a reflective beam expander mechanism for collimating and magnifying the laser light from the laser oscillator. The reflective beam expander mechanism includes a spherical mirror and a concave mirror having different curvatures in two orthogonal axes.
    Type: Application
    Filed: May 31, 2013
    Publication date: May 21, 2015
    Inventors: Naoyuki Nakamura, Tatsuya Yamamoto, Junichi Nishimae, Shuichi Fujikawa, Masaki Seguchi, Akinori Nishio, Hiroyuki Murai, Kenji Saruta
  • Publication number: 20130032580
    Abstract: An optical path structure of a laser processing machine that irradiates a laser beam from a processing head to a workpiece to perform laser processing, includes: a casing that has an opening, a light leading unit that includes a bend block including a bend mirror which deflects a laser beam traveling within the casing toward a side of the opening and an optical path tube which protrudes from the bend block toward the side of the opening for leading the laser beam to the processing head, a sealing member that is arranged at an edge part of the opening, a moving member that is abutting against the sealing member, that slides with respect to the sealing member, and that is fixed to the light leading unit, and a drive unit that integrally moves the moving member and the light leading unit in a longitudinal direction of the moving member.
    Type: Application
    Filed: November 11, 2011
    Publication date: February 7, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigeru Yokoi, Yasuhiko Iwai, Hajime Osanai, Kenji Saruta