Patents by Inventor Kenji Sasabe
Kenji Sasabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240125561Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Applicant: FUJITSU LIMITEDInventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
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Patent number: 11892246Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: GrantFiled: January 4, 2022Date of Patent: February 6, 2024Assignee: FUJITSU LIMITEDInventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20240032251Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.Type: ApplicationFiled: April 19, 2023Publication date: January 25, 2024Applicant: Fujitsu LimitedInventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
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Publication number: 20230320029Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.Type: ApplicationFiled: February 1, 2023Publication date: October 5, 2023Applicant: Fujitsu LimitedInventors: Yuki Kanai, Kenji Sasabe, Keita Hirai, Hideo Kubo, Atsushi Endo, Masahide Kodama, Takashi Urai
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Publication number: 20230240046Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.Type: ApplicationFiled: October 31, 2022Publication date: July 27, 2023Applicant: Fujitsu LimitedInventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
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Publication number: 20220346278Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.Type: ApplicationFiled: January 25, 2022Publication date: October 27, 2022Applicant: FUJITSU LIMITEDInventors: Masahide KODAMA, Hideo Kubo, KENJI SASABE, Nobumitsu Aoki, ATSUSHI ENDO, Keita Hirai
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Publication number: 20220322564Abstract: A cooling device includes: a downstream heat radiation member that includes a plurality of downstream fins; and an upstream heat radiation member that is arranged on an upstream side in a flow direction of cooling air with a gap from the downstream heat radiation member, includes a plurality of upstream fins, and is provided with a low pressure loss portion in which pressure loss is lower than pressure loss in another portion in one portion in a fin arrangement direction orthogonal to the flow direction.Type: ApplicationFiled: January 4, 2022Publication date: October 6, 2022Applicant: FUJITSU LIMITEDInventors: Hideo KUBO, Kenji SASABE, Shinnosuke FUJIWARA, Nobumitsu AOKI, Keita HIRAI, Atsushi ENDO, Masahide KODAMA, Kento OHGA
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Publication number: 20220307772Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.Type: ApplicationFiled: December 2, 2021Publication date: September 29, 2022Applicant: FUJITSU LIMITEDInventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
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Publication number: 20220299273Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: January 4, 2022Publication date: September 22, 2022Applicant: FUJITSU LIMITEDInventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20220117117Abstract: An electronic apparatus includes a flow rate control circuit that controls a plurality of flow rate adjusting mechanisms, based on desired flow rates of the coolant for a plurality of electronic circuits and information that indicates relationships between pressure losses and flow rates in a plurality of routes that include internal flow passages of the plurality of electronic circuits, a plurality of distribution pipes, a plurality of discharge pipes, and the plurality of flow rate adjusting mechanisms and in which the coolant flows between the first pipe and the second pipe.Type: ApplicationFiled: July 22, 2021Publication date: April 14, 2022Applicant: FUJITSU LIMITEDInventors: Masanori Tachibana, KENJI SASABE
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Patent number: 9661780Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.Type: GrantFiled: July 25, 2014Date of Patent: May 23, 2017Assignee: FUJITSU LIMITEDInventors: Michimasa Aoki, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
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Publication number: 20160327996Abstract: A cooling module includes: a heat exchanger mounted on an electronic part mounted on a board, and that cools the electronic part; a leaf spring including an overhang portion and an extension portion, the overhang portion overhanging outward beyond the heat exchanger from the heat exchanger, and the extension portion extending from the overhang portion in a direction intersecting an overhang direction of the overhang portion when viewed in a thickness direction of the board; and a support member located around the heat exchanger, and fixed to the board, the extension portion bent toward the board being attached to the support member.Type: ApplicationFiled: April 27, 2016Publication date: November 10, 2016Applicant: FUJITSU LIMITEDInventors: KENJI SASABE, Hideo Kubo, Tsuyoshi So, Nobumitsu Aoki, Masayuki Watanabe, Fumihiro TAWA, Yoshinori Uzuka
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Patent number: 9223362Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.Type: GrantFiled: September 17, 2013Date of Patent: December 29, 2015Assignee: FUJITSU LIMITEDInventors: Masayuki Watanabe, Kenji Sasabe, Eiji Wajima, Masumi Suzuki, Michimasa Aoki
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Publication number: 20150062822Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.Type: ApplicationFiled: July 25, 2014Publication date: March 5, 2015Applicant: FUJITSU LIMITEDInventors: Michimasa AOKI, Masumi Suzuki, Jie Wei, Fumihiro Tawa, Kenji Sasabe
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Publication number: 20140071616Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.Type: ApplicationFiled: September 17, 2013Publication date: March 13, 2014Applicant: FUJITSU LIMITEDInventors: Masayuki WATANABE, Kenji SASABE, Eiji WAJIMA, Masumi SUZUKI, Michimasa AOKI
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Patent number: 8564951Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.Type: GrantFiled: November 9, 2012Date of Patent: October 22, 2013Assignee: Fujitsu LimitedInventors: Masayuki Watanabe, Kenji Sasabe, Eiji Wajima, Masumi Suzuki, Michimasa Aoki
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Patent number: D714235Type: GrantFiled: March 5, 2013Date of Patent: September 30, 2014Assignee: Fujitsu LimitedInventors: Masayuki Watanabe, Yoshinori Uzuka, Kenji Sasabe, Eiji Wajima, Fumihiro Tawa, Takeshi Nishiyama, Jie Wei, Masumi Suzuki, Michimasa Aoki
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Patent number: D742337Type: GrantFiled: February 6, 2014Date of Patent: November 3, 2015Assignee: FUJITSU LIMITEDInventors: Masayuki Watanabe, Hideki Kimura, Kenji Sasabe, Fumihiro Tawa, Takeshi Nishiyama, Jie Wei, Masumi Suzuki, Michimasa Aoki