Abstract: Disclosed is a component built-in wiring board including: a first insulating layer on a second one having laminated at least two insulating layers; a semiconductor chip buried in the second insulating layer, having a terminal pad; a wiring pattern between the first and the second insulating layers, including a mounting land and having a roughened surface facing the second insulating layer; a conductive bump between the terminal pad and the mounting land; a resin between the semiconductor chip and both the first insulating layer and the wiring pattern; a second wiring pattern between the at least two insulating layers; and an interlayer connector between surfaces of the wiring pattern and the second wiring pattern to penetrate partly through the second insulating layer in a layered direction, made of a conductive composition, and having a shape with an axis along the layered direction and a diameter varying in an axial direction.

Abstract: Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.

Abstract: Disclosed is a component built-in wiring board, including a first insulating layer; a second insulating layer positioned in a laminated state on the first insulating layer; a semiconductor element buried in the second insulating layer, having a semiconductor chip with terminal pads and having surface mounting terminals arrayed in a grid shape connected electrically with the terminal pads; an electric/electronic component further buried in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic component; a first connecting member connecting electrically the surface mounting terminal of the semiconductor element with the first mounting land; and a second connecting member connecting electrically the terminals of the electric/electronic component with the second mounting land, made of a same material as a material of the first c

Abstract: Disclosed is a component built-in wiring board, including a first insulating layer; a second insulating layer positioned in a laminated state on the first insulating layer; a semiconductor element buried in the second insulating layer, having a semiconductor chip with terminal pads and having surface mounting terminals arrayed in a grid shape connected electrically with the terminal pads; an electric/electronic component further buried in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic component; a first connecting member connecting electrically the surface mounting terminal of the semiconductor element with the first mounting land; and a second connecting member connecting electrically the terminals of the electric/electronic component with the second mounting land, made of a same material as a material of the first c

Abstract: An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

Abstract: Disclosed is a component built-in wiring board, including a first insulating layer; a second insulating layer positioned in a laminated state on the first insulating layer; a semiconductor element buried in the second insulating layer, having a semiconductor chip with terminal pads and having surface mounting terminals arrayed in a grid shape connected electrically with the terminal pads; an electric/electronic component further buried in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a first mounting land for the semiconductor element and a second mounting land for the electric/electronic component; a first connecting member connecting electrically the surface mounting terminal of the semiconductor element with the first mounting land; and a second connecting member connecting electrically the terminals of the electric/electronic component with the second mounting land, made of a same material as a material of the first c

Abstract: An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: Provided is a wiring board with a built-in component, which has an electric/electronic component (16) embedded in an insulating substrate (11). A method for manufacturing such wiring board is also provided. Manufacture burden is reduced and reliability is improved by such wiring board and the method. The wiring board is provided with a wiring pattern (12); the electric/electronic component electrically and mechanically connected on the surface of the wiring pattern; and an insulating layer (11A), which has the electric/electronic component embedded therein, is laminated on the surface on the side whereupon the electric/electronic component of the wiring pattern is connected, and has a reinforcing material (11b) in a region other than a region (11o) where the electric/electronic component is embedded.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: A ground pattern (12) and power supply pattern (13) which are formed on the surface of a printed wiring board (10) are connected to a ground layer (21) and power supply layer (22) formed as the internal layers via bumps (24a, 24b). The ground pattern (12) need not be connected to the ground layer (21) by uniformly plating the inner side surface of a cavity (43), contributing to an increase in yield and a decrease in cost. When a power supply pattern (13) is to be connected to a power supply layer (22) using through holes, the power supply pattern (13) must be spaced apart from signal pins (14) detouring the region where the through holes are to be formed. However, the distance between the power supply pattern and the signal pins can.be reduced by using bumps. The distance between a semiconductor chip (41) and the signal pins (14) can be reduced to improve the electrical characteristics.