Patents by Inventor Kenji Senga

Kenji Senga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8570685
    Abstract: A wafer for a magnetic head includes a magnetic pole which has a design capable of avoiding pole missing due to processing with an improved resistance to the processing during a magnetic pole forming process. Each magnetic head element provided in the wafer has a recording magnetic pole film. The magnetic pole film has a large width part, a small width part and a support part. The small width part projects continuously from the large width part and extends with a constant width W1, while the support part is continuous with an end of the small width part and has a width W2. The width W1 and the width W2 satisfy the relationship of 1<W2/W1<2.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: October 29, 2013
    Assignee: TDK Corporation
    Inventors: Katsuya Kanakubo, Kenji Senga
  • Publication number: 20130271872
    Abstract: A wafer for a magnetic head includes a magnetic pole which has a design capable of avoiding pole missing due to processing with an improved resistance to the processing during a magnetic pole forming process. Each magnetic head element provided in the wafer has a recording magnetic pole film. The magnetic pole film has a large width part, a small width part and a support part. The small width part projects continuously from the large width part and extends with a constant width W1, while the support part is continuous with an end of the small width part and has a width W2. The width W1 and the width W2 satisfy the relationship of 1<W2/W1<2.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Applicant: TDK Corporation
    Inventors: Katsuya KANAKUBO, Kenji Senga