Abstract: Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Abstract: Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Abstract: Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Abstract: It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

Abstract: It is provided that a polyester composition for electrical/electronic part-sealing material having melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required for electrical/electronic part-sealing material while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling. A polyester resin composition for electrical/electronic part-sealing material, comprising, as a main component, a copolymer polyester elastomer containing 50 weight % or more and 70 weight % or lower of an aliphatic polycarbonate segment and having 6 equivalents/106 g or more and 50 equivalents/106 g or lower of terminal vinyl groups.

Abstract: Provided is a flame-retardant resin composition which has excellent flame retardancy and less bleed out, while exhibiting high transparency that is close to the original state of a thermoplastic resin. This flame-retardant resin composition contains (A) a thermoplastic resin, (B) a copolymerized polyester resin wherein a phosphorus-containing component represented by general formula (1) is copolymerized, and (C) a phosphorus-containing compound represented by general formula (2). General formula (1); (In general formula (1), each of R1 and R2 independently represents a substituent such as an alkyl group having 1-4 carbon atoms; each of m and n independently represents an integer of 0-4; and B represents an ester-forming functional group.

Abstract: It is provided that a resin composition for sealing electrical and electronic parts that can provide a flame-retardant sealed electrical and electronic part having no bleed out of a flame resistor while maintaining filling properties of a sealant in the practical level and adhesion between the sealant and an electrical and electronic part. A resin composition for sealing electrical and electronic parts, comprising a copolymer polyester elastomer (X), a brominated epoxy resin (B1), a non-brominated epoxy resin (B2) and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3.0×103 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and then extruded from a die having a hole diameter of 1.0 mm and a thickness of 10 mm, a sealed electrical and electronic part using the resin composition for sealing electrical and electronic part, and a method for producing the sealed electrical and electronic parts.

Abstract: It is provided that a polyester composition for electrical/electronic part-sealing material having melt fluidity, initial peel strength, and initial dielectric breakdown strength that are required for electrical/electronic part-sealing material while also having excellent heat resistance, resistance to thermal aging, and durability with respect to hot-cold cycling. A polyester resin composition for electrical/electronic part-sealing material, comprising, as a main component, a copolymer polyester elastomer containing 50 weight % or more and 70 weight % or lower of an aliphatic polycarbonate segment and having 6 equivalents/106 g or more and 50 equivalents/106 g or lower of terminal vinyl groups.

Abstract: It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

Abstract: An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

Abstract: A thin-walled light resin composition engine cover has reduced mass and thickness while retaining radiated sound reduction effects, heat resistance, and mechanical properties. The cover has an average thickness of 2.0 mm or less. The resin composition includes (a) a polyamide resin composed of essentially at least one of scrap of vehicle airbag fabric made of nylon 66 containing a copper-based stabilizer and vehicle airbag fabric recycled, (b) a modified polypropylene resin, (c) a reinforcement material, (d) a metal deactivator and a photo-thermal stabilizer, and (e) a viscosity regulator. The resin composition has a melt flow rate of not less than 40 g/10 min.

Abstract: An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

Abstract: A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

Abstract: A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

Abstract: A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

Abstract: A brake disc material which does not crack under a great braking action, such as in a large-sized truck, consisting of 0.03 percent to 1 percent of carbon, 1.2 percent to 20 percent of chromium, and 0.1 percent to 1 percent of molybdenum, the balance being essentially iron.