Publication number: 20230365893
Abstract: A cleaning composition for semiconductor substrates. The cleaning composition comprises hydrogen peroxide, a hydrogen peroxide stabilizing agent, an alkaline compound, and water. The hydrogen peroxide stabilizing agent is oxalic acid, diethylenetriaminepentaacetic acid, hydroxyethyliminodiacetic acid, potassium oxalate, 5-phenyl-1H-tetrazole, triethylenetetraminehexaacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, 8-quinolinol, L(+)-isoleucine, DL-valine, L(-)-proline, hydroxyethylethylenediaminetriacetic acid, N,N-di(2-hydroxyethyl)glycine, glycine, L-tryptophan, 2,6-pyridinedicarboxylic acid, benzothiazole, or DL-alanine. The alkaline compound is a quaternary ammonium hydroxide or potassium hydroxide.
Type:
Application
Filed:
September 22, 2021
Publication date:
November 16, 2023
Applicant:
MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventors:
Hiroaki HORIE, Akinobu HORITA, Makoto HAMANAKA, Kenji SHIMADA, Takahiro KIKUNAGA