Patents by Inventor Kenji Shimomura
Kenji Shimomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060071591Abstract: A semiconductor light emitting device comprises: a semiconductor light emitting element that emits light of a first wavelength; at least two kinds of phosphors that absorb the light of the first wavelength and then emit wavelength-converted light; sealing resin in which the at least two kinds of phosphors are dispersed and the semiconductor light emitting element is embedded; and binder resin. Combined bodies in which the at least two kinds of phosphors are combined by the binder resin are dispersed in the sealing resin.Type: ApplicationFiled: September 1, 2005Publication date: April 6, 2006Applicants: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.Inventors: Hatsuo Takezawa, Kenji Shimomura, Hiroaki Oshio, Yasuhiro Shirakawa, Tsutomu Ishii
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Publication number: 20040217369Abstract: A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.Type: ApplicationFiled: March 8, 2004Publication date: November 4, 2004Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Koichi Nitta, Kenji Shimomura, Hiroaki Oshio, Takeshi Komatsu
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Patent number: 6747293Abstract: A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.Type: GrantFiled: April 8, 2002Date of Patent: June 8, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Koichi Nitta, Kenji Shimomura, Hiroaki Oshio, Takeshi Komatsu
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Patent number: 6710377Abstract: A light emitting device includes a semiconductor light emitting element and a silicone resin provided to embed said semiconductor light emitting element, where silicone resin has a hardness not lower than 50 in JISA value. The use of a silicone resin as the resin for sealing the semiconductor light emitting elements instead of conventional epoxy resins can reduce the possibility of cracks, exfoliation, breakage of wire, etc. that were often caused by conventional epoxy resins, and can also improve the resistance to whether and light.Type: GrantFiled: April 9, 2002Date of Patent: March 23, 2004Assignee: Kabushiki Kaisha ToshibaInventor: Kenji Shimomura
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Patent number: 6552457Abstract: A support structure for a drive source such as a motor of the blower is disclosed in which the generation of noise caused by the vibration of the motor is suppressed. The flange of a support member has a low-stiffness portion having a thickness smaller than a high-stiffness portion of the same flange. The low-stiffness portion is thus vibrated more easily than the high-stiffness portion. When the motor vibrates, therefore, the vibration rate of the low-stiffness portion increases beyond that of the high-stiffness portion, so that the low-stiffness portion vibrates considerably. The motor vibration is thus absorbed by the flange (support member) and the transmission of the motor vibration to a casing can be suppressed. As a result, the area of the sound source of the blower is decreased as a whole, thereby making it possible to suppress the generation of noise caused by the vibration of the motor.Type: GrantFiled: March 27, 2001Date of Patent: April 22, 2003Assignees: Denso Corporation, Asmo Co., Ltd.Inventors: Naoki Uruma, Yasufumi Kojima, Makoto Ozeki, Kenji Shimomura, Toshihiro Tanino, Yousuke Natsume
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Publication number: 20020190262Abstract: A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.Type: ApplicationFiled: April 8, 2002Publication date: December 19, 2002Inventors: Koichi Nitta, Kenji Shimomura, Hiroaki Oshio, Takeshi Komatsu
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Publication number: 20020163302Abstract: A light emitting device, free from change of color even when the wavelength of a light emitting element shifts, includes a light emitting element (106) for emitting primary light having an intensity peak at a wavelength shorter than 400 nm; a silicone resin (111) provided to embed the light emitting element; and a fluorescent element (110) contained in the silicone resin to absorb the primary light and release visible light.Type: ApplicationFiled: April 8, 2002Publication date: November 7, 2002Inventors: Koichi Nitta, Hiroaki Oshio, Kenji Shimomura, Tomokazu Kitajima, Nozomu Takahashi, Yuji Takahashi, Toshiya Uemura, Koichi Ota
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Publication number: 20020145152Abstract: A light emitting device includes a semiconductor light emitting element and a silicone resin provided to embed said semiconductor light emitting element, where silicone resin has a hardness not lower than 50 in JISA value. The use of a silicone resin as the resin for sealing the semiconductor light emitting elements instead of conventional epoxy resins can reduce the possibility of cracks, exfoliation, breakage of wire, etc. that were often caused by conventional epoxy resins, and can also improve the resistance to whether and light.Type: ApplicationFiled: April 9, 2002Publication date: October 10, 2002Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Kenji Shimomura
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Publication number: 20010026107Abstract: A support structure for a drive source such as a motor of the blower is disclosed in which the generation of noise caused by the vibration of the motor is suppressed. The flange of a support member has a low-stiffness portion having a thickness smaller than a high-stiffness portion of the same flange. The low-stiffness portion is thus vibrated more easily than the high-stiffness portion. When the motor vibrates, therefore, the vibration rate of the low-stiffness portion increases beyond that of the high-stiffness portion, so that the low-stiffness portion vibrates considerably. The motor vibration is thus absorbed by the flange (support member) and the transmission of the motor vibration to a casing can be suppressed. As a result, the area of the sound source of the blower is decreased as a whole, thereby making it possible to suppress the generation of noise caused by the vibration of the motor.Type: ApplicationFiled: March 27, 2001Publication date: October 4, 2001Inventors: Naoki Uruma, Yasufumi Kojima, Makoto Ozeki, Kenji Shimomura, Toshihiro Tanino, Yousuke Natsume
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Patent number: 5538731Abstract: A cosmetic containing a solvent extract of trapae fructus according to the present invention has a large skin depigmental action, and inhibits a hyaluronidase action. In consequence, the lubricity and flexibility of the skin are maintained and aging is also prevented. In addition, the cosmetic of the present invention inhibits the production of active oxygen and has antioxydation, and therefore the oxidation of fatty acids is prevented, so that the production of peroxides is suppressed, which leads to the prevention of the aging of the skin. Therefore, the cosmetic of the present invention prevents rough skin and keep skin luster and skin elasticity in a good state. The safety of the trapae fructus to the skin of humans has been assured by using it as food for a long period of time.Type: GrantFiled: November 21, 1994Date of Patent: July 23, 1996Assignee: Mikimoto Pharmaceutical Co., Ltd.Inventors: Kenji Shimomura, Masami Nakamura
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Patent number: 4777189Abstract: Flame-retardant polyurethane foam having a very good skin weldability and a very low level of skin staining is produced from a polyhydroxy compound, organic polyisocyanate, blowing agent, catalyst, foam stabilizer, and flame retardant, and other additives, wherein the flame retardant contains a triaryl phosphate ester and the polyhydroxy compound is a mixture composed of 100 parts by weight of high-molecular-weight polyhydroxy compound having a hydroxyl number lower than 100 and 0.5 to 10 parts by weight of low-molecular-weight polyhydroxy compound having a hydroxyl number higher than 560 and having 2 to 4 hydroxyl groups in one molecule.Type: GrantFiled: June 30, 1987Date of Patent: October 11, 1988Assignees: Ikeda Bussan Co., Ltd., Bridgestone CorporationInventors: Kenji Shimomura, Shigeaki Kouketsu, Toru Okuyama, Take Sato
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Patent number: 4696952Abstract: Flame-retardant polyurethane foam having a very good skin weldability and a very low level of skin staining is produced from a polyhydroxy compound, organic polyisocyanate, blowing agent, catalyst, foam stabilizer, and flame retardant, and other additives, wherein the flame retardant contains a triaryl phosphate ester and the polyhydroxy compound is a mixture composed of 100 parts by weight of high-molecular-weight polyhydroxy compound having a hydroxyl number lower than 100 and 0.5 to 10 parts by weight of low-molecular-weight polyhydroxy compound having a hydroxyl number higher than 560 and having 2 to 4 hydroxyl groups in one molecule.Type: GrantFiled: July 19, 1985Date of Patent: September 29, 1987Assignees: Ikeda Bussan Co., Ltd., Bridgestone Corp.Inventors: Kenji Shimomura, Shigeaki Kouketsu, Toru Okuyama, Take Sato
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Patent number: 4587273Abstract: Disclosed is a method for manufacturing a flame-retardant polyurethane foam which comprises the steps of:mixing a polyether polyol, an organic polyisocyanate, water, a surfactant, a catalyst containing a metal and a tertiary amine catalyst to form a mixture; and reacting the mixture to form a polyurethane foam,the improvement wherein 1 to 15 parts by weight of a triarylphosphate and 1 to 15 parts by weight of a complex salt consisting of a sintered mixture comprising silico-zirconate and antimony oxide are added to said mixture based on 100 parts by weight of said polyether polyol, respectively.The method for manufacturing a flame-retardant polyurethane foam of this invention generates no poisonous gas at manufacturing process and the resultant polyurethane foam has excellent flame retardant characteristics and causes no corrosion of a surface material thereof.Type: GrantFiled: August 9, 1985Date of Patent: May 6, 1986Assignee: Ikeda Bussan Co., Ltd.Inventor: Kenji Shimomura
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Patent number: 4495120Abstract: A method for the manufacture of shaped articles of polyurethane foam, which comprises pretreating metal molds for at least two types of shaped articles of polyurethane foam conveyed on conveyor units connected to heater units, forwarding said metal molds on the conveyor units according to the types of shaped articles to be produced, adjusting temperatures of said metal molds, feeding relevant polyurethane dopes to said metal molds, conveying said metal molds containing the dopes on conveyor units into the heater unit containing hot water, and immersing said metal molds in the hot water thereby allowing the dopes to foam and set within said metal molds.Type: GrantFiled: November 9, 1981Date of Patent: January 22, 1985Assignee: Ikeda Bussan Co., Ltd.Inventor: Kenji Shimomura
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Patent number: 4486367Abstract: Process for producing polyurethane-foam moldings and apparatus for the same; the polyurethane-foam moldings are produced through the steps of pre-treating molds and injecting a foamable polyurethane resin reaction mixture into the molds; carrying the molds with the foamable polyurethane resin reaction mixture injected therein to a reservoir tank containing a heated liquid such as hot water or oil and dipping them into the liquid; and carrying the dipped molds out of the reservoir tank and opening them to take out the moldings thus produced.Type: GrantFiled: September 22, 1983Date of Patent: December 4, 1984Assignee: Ikeda Bussan Co., Ltd.Inventor: Kenji Shimomura
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Patent number: D471166Type: GrantFiled: October 2, 2001Date of Patent: March 4, 2003Assignee: Kabushiki Kaisha ToshibaInventors: Hiroaki Oshio, Kenji Shimomura, Koichi Nitta