Patents by Inventor Kenji SUETSUGU

Kenji SUETSUGU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10763184
    Abstract: A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: September 1, 2020
    Assignee: Kyocera Corporation
    Inventors: Kenji Suetsugu, Akira Takeo, Kensou Ochiai
  • Publication number: 20190181066
    Abstract: A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.
    Type: Application
    Filed: April 25, 2017
    Publication date: June 13, 2019
    Applicant: KYOCERA Corporation
    Inventors: Kenji SUETSUGU, Akira TAKEO, Kensou OCHIAI