Patents by Inventor Kenji Suga
Kenji Suga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7456730Abstract: An anomaly judgment system includes an actuating switch and an anomaly judgment unit for judging anomaly of an operator detection device that is turned into an ON state when detecting an operator in a vehicle. The actuating switch is operable to be turned into an ON state by the operator. The anomaly judgment unit judges the operator detection device as anomalous when a time period during which the actuating switch is in an OFF state with the operator detection device in the ON state exceeds a predetermined time period.Type: GrantFiled: December 13, 2005Date of Patent: November 25, 2008Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Kazutoshi Yamada, Kenji Suga, Toshikazu Kamiya, Tadashi Yamada, Toshinari Fukatsu
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Publication number: 20060139179Abstract: An anomaly judgment system includes an actuating switch and an anomaly judgment unit for judging anomaly of an operator detection device that is turned into an ON state when detecting an operator in a vehicle. The actuating switch is operable to be turned into an ON state by the operator. The anomaly judgment unit judges the operator detection device as anomalous when a time period during which the actuating switch is in an OFF state with the operator detection device in the ON state exceeds a predetermined time period.Type: ApplicationFiled: December 13, 2005Publication date: June 29, 2006Inventors: Kazutoshi Yamada, Kenji Suga, Toshikazu Kamiya, Tadashi Yamada, Toshinari Fukatsu
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Patent number: 6702000Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.Type: GrantFiled: August 10, 2001Date of Patent: March 9, 2004Assignees: Matsushita Electric Industrial Co., Ltd., Kabushiki Kaisha ToshibaInventors: Masaharu Miyahara, Koji Mehara, Kenji Suga, Kazuya Shibasaki, Hiroshi Nakamura, Hironori Ito
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Publication number: 20020000308Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.Type: ApplicationFiled: August 10, 2001Publication date: January 3, 2002Inventors: Masaharu Miyahara, Koji Mehara, Kenji Suga, Kazuya Shibasaki, Hiroshi Nakamura, Hironori Ito
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Patent number: 6315031Abstract: A blower is provided for effectively cooling heat generating parts in a casing of a personal computer and so on, with a heat sink apparatus using the blower and an electronic equipment using the heat sink apparatus. The blower comprises a fan and an outer frame. The outer frame of the fan is made of a highly thermally conductive material such as aluminum. A radiation board is fixed to or formed integrally with a lower surface of the outer frame. Heat generated from a heat generating device is conveyed through the radiation board to the outer frame. The blower is provided with radiation fins so that the heat conveyed to the outer frame is transferred to the radiation fins as well.Type: GrantFiled: March 29, 1996Date of Patent: November 13, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Miyahara, Koji Mehara, Kenji Suga, Kazuya Shibasaki, Hiroshi Nakamura, Hironori Ito
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Patent number: 6172416Abstract: It is intended to provide a heat sink unit and an electronic apparatus capable of efficiently cooling a plurality of semiconductor devices and taking action for unnecessary electromagnetic waves. There are provided a plurality of fan units and electromagnetic shielding means for cutting off electromagnetic waves on a heat sink substrate. It is also provided a heat sink substrate, a unit having a fan for supplying fluid to the heat sink substrate and driving means for rotating the fan, and electromagnetic shielding means provided for the heat sink substrate.Type: GrantFiled: February 5, 1998Date of Patent: January 9, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Miyahara, Kenji Suga, Hisao Tada, Sumio Tate, Kazuhiko Sugimoto
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Patent number: 6097598Abstract: There is disclosed a thermal conductive member which can be easily handled, and has high thermal conductivity and the high ability of intimate contact with a heat-generating device and a heatsink, and applies a small stress to a semiconductor package. An electronic device, using this thermal conductive member, is also disclosed. The thermal conductive member connects the heat-generating member to the heatsink serving to radiate heat generated by said heat-generating member, and includes an elastic member, and a thermal conductive foil wound on an elastic member in intimate contact therewith. The electronic device includes the heat-generating member such as a semiconductor, the heatsink for radiating heat generated by the heat-generating member, and the above thermal conductive member interposed between the heat-generating device and the heatsink.Type: GrantFiled: February 12, 1998Date of Patent: August 1, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Miyahara, Kenji Suga
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Patent number: 5940268Abstract: A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.Type: GrantFiled: April 1, 1997Date of Patent: August 17, 1999Assignee: Matsushita Electric Industrial Co. Ltd.Inventors: Masaharu Miyahara, Yasushi Inoue, Kenji Suga
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Patent number: 5065320Abstract: In a battery powered vehicle such as an forklift truck, control data is stored in a memory (39) by an operation of the keys (11a, 11b, 11c, 11d, 11e) on a control panel (10) mounted at the operation seat, and a part of the control data is selected by a control circuit (30) and transmitted to a travelling control circuit. The travelling control circuit controls a travelling motor (101) with the characteristics decided by the selected data and the selected control data is indicated on a display panel (12). A plurality of data used for maintenance administration, such as a cumulative travelling distance or cumulative operating hours, are stored in a memory and one of the data for maintenance administration is arbitrarily indicated on the display panel (12) and converted to meet the specified indication specification through the control circuit (30) by operation of the keys (11e) on said control panel (10).Type: GrantFiled: September 27, 1989Date of Patent: November 12, 1991Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Takashi Hayashi, Junichi Hida, Kenji Suga, Yoshikazu Kurata
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Patent number: RE38382Abstract: A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.Type: GrantFiled: August 16, 2001Date of Patent: January 13, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Miyahara, Yasushi Inoue, Kenji Suga
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Patent number: RE40369Abstract: A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.Type: GrantFiled: September 23, 2003Date of Patent: June 10, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Miyahara, Yasushi Inoue, Kenji Suga