Abstract: A wire harness according to one aspect of the present disclosure includes: a first wire harness that includes a first electric wire, a first shielding member, and a first connector; a second wire harness that includes a second electric wire, a second shielding member, and a second connector; and a connection member that electrically connects a drain wire of the first shielding member and a drain wire of the second shielding member to each other. A drain wire drawn out from an end portion of the first shielding member on the first connector side is grounded. A drain wire drawn out from an end portion of the second shielding member on the second connector side is inserted into a vacant cavity of the second connector.

Abstract: Embodiments described herein include an electronic beacon system mounted to an unmanned aerial system (UAS) broadcasting identification and sensor data including a UAS identification code, global positioning system data and other telemetry information. In certain embodiments, identification and global positioning system data of the unmanned aerial system is transmitted to and displayed upon a mobile handheld device. Other embodiments include using the identification data to ascertain the identity of the owner/operator of an unmanned aerial system. Related systems, hardware, firmware, and software are disclosed.

Abstract: Embodiments described herein include an electronic beacon system mounted to an unmanned aerial system (UAS) broadcasting identification and sensor data including a UAS identification code, global positioning system data and other telemetry information. In certain embodiments, identification and global positioning system data of the unmanned aerial system is transmitted to and displayed upon a mobile handheld device. Other embodiments include using the identification data to ascertain the identity of the owner/operator of an unmanned aerial system. Related systems, hardware, firmware, and software are disclosed.

Abstract: An electronic machine, a display apparatus and a communication apparatus are provided which are capable of minimizing an increase in the dimensions of an apparatus body which is ascribed to the improvement of the controllability of the apparatus and an increase in the sizes of a display screen. A case unit is pivotably joined to an apparatus body by a pivot, and an upper operating element of a cross key and function keys are provided so that these parts are positioned on the axis of the pivot. Thus, an operating force occurring when the upper operating element and function keys are operated is exerted on the axis of the pivot.

Abstract: An object of the present invention is to provide a document end detecting unit which detects a front-end of a moving document with reliability. In a document reading unit equipped with a document end detecting unit, on the surface of a back member which is on the opposite side to a light-receiving section and a light source when viewed from a reference position, a slot which is substantially parallel to a moving direction of a document is formed. A detecting section detects a shade of a document front-end appearing at the slot based on data of the reflected light amount from light-receiving elements in the light-receiving section which receive light reflected from the slot of the back member, and detects timing when the document front-end reaches the reference position based on a result of detecting the shade. This allows a document front-end to be detected with reliability.

Abstract: An electronic machine, a display apparatus and a communication apparatus are provided which are capable of minimizing an increase in the dimensions of an apparatus body which is ascribed to the improvement of the controllability of the apparatus and an increase in the sizes of a display screen. A case unit is pivotably joined to an apparatus body by a pivot, and an upper operating element of a cross key and function keys are provided so that these parts are positioned on the axis of the pivot. Thus, an operating force occurring when the upper operating element and function keys are operated is exerted on the axis of the pivot.

Abstract: In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface, and pads provided in a peripheral portion of the second opening on the first surface side of the recession section. A semiconductor element mounted on a mount substrate is inserted in the first opening from the second surface side of the ceramic package. The semiconductor element is smaller than the mount substrate and has pads in a peripheral portion of the semiconductor element. The pads on the recession section and the pads on the semiconductor element are connected by electrically conductive wires.

Abstract: A printing apparatus includes an apparatus body for printing on recording paper, and a paper feed cassette attached rotatable over a prescribed range on the apparatus body and feeding the recording paper to the apparatus body. As the paper feed cassette is attached rotatable over a prescribed range on the apparatus body, it is possible to freely open/close a top cabinet, even when the printing apparatus is placed without sufficient space therebehind.

Abstract: In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface, and pads provided in a peripheral portion of the second opening on the first surface side of the recession section. A semiconductor element mounted on a mount substrate is inserted in the first opening from the second surface side of the ceramic package. The semiconductor element is smaller than the mount substrate and has pads in a peripheral portion of the semiconductor element. The pads on the recession section and the pads on the semiconductor element are connected by electrically conductive wires.

Abstract: An Tape-BGA type semiconductor device can absorb and/or distribute stress created due to difference of thermal expansion between a reinforcement plate of a TAB tape and a mounting substrate to stabilize mounting on a substrate. The Tape-BGA type semiconductor device includes leads formed on an insulative resin film, and electrically connected to electrodes of a semiconductor chip at tip ends thereof, a reinforcement plate formed with an opening portion receiving the semiconductor chip and fixed on the surface of the insulative resin film, a plurality of ball-shaped bumps are arranged on externally connecting portions of the leads in a grid-array fashion, and the reinforcement plate being provided with slits along the opening portion for distributing stress.

Abstract: A ball grid array package provides conductive paths between terminals and a semiconductor chip through via-hole plugs formed in a circuit board, and the via-hole plugs are covered with a rigid plate before sealing the semiconductor chip in synthetic resin so as to prevent the via-hole plugs from penetration of the synthetic resin.

Abstract: There is provided a tape automated bonding (TAB) tape including, a first film having a first open space therewithin, a second film having a second open space therewithin, the first film being located in the second open space, a third film located in the first open space of the first film, a first closed-loop wiring formed on the second film, a second closed-loop wiring formed on the third film, at least one signal wiring formed on the first film, and at least one ground wiring formed on the first film, the ground wiring inwardly and outwardly extending from the first film to connect the first and second closed-loop wirings to each other. The TAB tape makes it possible to increase the number of the ground wirings by providing the closed-loop wirings. As a result, it is possible to reduce effective inductance and ground bounce noises of the ground wirings, and further possible to reduce mutual capacities among the signal wirings with the result of reduced cross-talk noises.

Abstract: A ball-grid-array-type semiconductor device has upper signal interconnections (1a) and a semiconductor element mounting pad (4) disposed on an upper surface of a glass epoxy substrate (7), and four extension patterns (5) extending from the semiconductor element mounting pad (4) to respective four corners of the glass epoxy substrate (7). The upper signal interconnections (1a) are connected by via-holes (2) to lower signal interconnections (1b) disposed on a lower surface of the glass epoxy substrate (7). A semiconductor element (10) is mounted on the semiconductor element mounting pad (4) and has electrodes (3) connected to the upper signal interconnections (10) by thin metal wires (11). The semiconductor element (10) mounted on the semiconductor element mounting pad (4) is sealed by a molding resin layer (9). Solder balls (3) are fused to the lower surface of the glass epoxy substrate (7) and connected to the lower signal interconnections (1b).

Abstract: A clock driver is mounted in the center of a printed-circuit board, and a plurality of synchronous DRAMs are arranged on left and right hand sides of the clock driver in different banks. A clock signal is supplied from the clock driver to the synchronous DRAMs via clock wires. Wiring distances for supplying the clock pulse from the clock driver to a pair of synchronous DRAMs included in the different banks are determined to nearly equal to prevent a time difference of a timing signal in a data recording and reproducing operations of the respective banks and to solve a skew mismatching.

Abstract: Embodiments described herein include an electronic beacon system mounted to an unmanned aerial system (UAS) broadcasting identification and sensor data including a UAS identification code, global positioning system data and other telemetry information. In certain embodiments, identification and global positioning system data of the unmanned aerial system is transmitted to and displayed upon a mobile handheld device. Other embodiments include using the identification data to ascertain the identity of the owner/operator of an unmanned aerial system. Related systems, hardware, firmware, and software are disclosed.