Abstract: A nobel therapeutic agent for diabetes which can suppress occurrence of side effects such as persistent hypoglycemia is provided. The active ingredient is a derivative of 1,1-diphenylsemicarbazide or 1,1-diphenylthiosemicarbazide. In particular, the active ingredient is a derivative of 1,1-diphenyl-4-cyclohexyl-semicarbazide or 1,1-diphenyl-4-cyclohexyl-thiosemicarbazide exhibiting hypoglycemic action when orally administered.

Abstract: A nobel therapeutic agent for diabetes which can suppress occurrence of side effects such as persistent hypoglycemia is provided. The active ingredient is a derivative of 1,1-diphenylsemicarbazide or 1,1-diphenylthiosemicarbazide. In particular, the active ingredient is a derivative of 1,1-diphenyl-4-cyclohexyl-semicarbazide or 1,1-diphenyl-4-cyclohexyl-thiosemicarbazide exhibiting hypoglycemic action when orally administered.

Abstract: A negative electrode for nonaqueous-electrolytic-solution secondary cells is provided. The negative electrode for nonaqueous-electrolytic-solution secondary cells includes a first active substance layer on a current collector, and a second active substance layer covering the first active substance layer. The first active substance layer is one containing a first active substance capable of reversibly alloying with lithium, a conductive aid and a binder resin, and the second active substance layer is one containing a second active substance capable of reversibly absorbing and releasing lithium, a conductive aid and a binder resin.

Abstract: In a cutting insert, a cutting edge is formed on a peripheral border of a rake face; a protruding section is formed on the rake face; a pair of convex sections is formed so as to extend toward the cutting edge; the convex sections face toward a corner portion; the convex sections include first wall surfaces and second wall surfaces; the first wall surfaces and the second wall surfaces are inclined surfaces that are inclined toward the rake face as those are farther from ridgelines intersecting with each other; and the intersection ridgelines intersect with a wall surface of the protruding section, at a position lower than a top portion of the protruding section in the corner portion side.

Abstract: The cutting insert is provided with an insert main body, a cutting edge formed at a circumferential edge of the rake face of the insert main body to have a corner edge and two side edges arranged on the both sides thereof, a protrusion portion formed on the rake face, and a pair of convex portions formed on both sides divided by a bisector of the corner edge. Each of the pair of convex portions is provided with a first wall surface facing the corner edge of the cutting edge, and a second wall surface facing the side edge. On the rake face closer to the corner edge than the pair of convex portions, a recess having a rear wall portion which extends so as to cross the bisector between the corner edge and the convex portion is formed.

Abstract: In a cutting insert, a cutting edge is formed on a peripheral border of a rake face; a protruding section is formed on the rake face; a pair of convex sections is formed so as to extend toward the cutting edge; the convex sections face toward a corner portion; the convex sections include first wall surfaces and second wall surfaces; the first wall surfaces and the second wall surfaces are inclined surfaces that are inclined toward the rake face as those are farther from ridgelines intersecting with each other; and the intersection ridgelines intersect with a wall surface of the protruding section, at a position lower than a top portion of the protruding section in the corner portion side.

Abstract: Improving detectability of a diameter of a pressure-bonded ball bonded by a bonding apparatus by calculating the diameter of the pressure-bonded ball by obtaining a first tentative radius by subtracting a distance between a line representing an outline of a pad short side and a curving line representing an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; obtaining a second tentative radius by subtracting a distance between a line representing an outline of a pad short side that faces toward the pad with which the first tentative radius is calculated and an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; and averaging the same number of the first and the second tentative radii.

Abstract: A particulate sampling apparatus configured to control the flow direction of a dispersion solvent for particulates, at a channel branching section of a channel includes an introduction channel capable of introducing the dispersion solvent, and a plurality of branch channels communicating with the introduction channel, so as to disperse desired ones of the particulates into a selected one of the branch channels, wherein the apparatus includes light irradiation means by which a bubble can be generated in the dispersion solvent by irradiation with a laser beam used as a heat source, and the flow direction of the dispersion solvent at the channel branching section is controlled by the bubble.

Abstract: A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit.

Abstract: The cutting insert is provided with an insert main body, a cutting edge formed at a circumferential edge of the rake face of the insert main body to have a corner edge and two side edges arranged on the both sides thereof, a protrusion portion formed on the rake face, and a pair of convex portions formed so as to extend out to the side edges on both sides divided by a bisector of the corner edge from a wall surface of the protrusion portion to the rake face. Each of the pair of convex portions is provided with a first wall surface which extends so as to separate gradually from each other toward the cutting edge from the wall surface of the protrusion portion, and facing the corner edge of the cutting edge, and a second wall surface in contact with the first wall surface and continuing to both ends of the corner edge, facing the side edge. The first and the second wall surfaces incline toward the rake face as they extend away from a ridge line between the both wall surfaces.

Abstract: Improving detectability of a diameter of a pressure-bonded ball bonded by a bonding apparatus by calculating the diameter of the pressure-bonded ball by obtaining a first tentative radius by subtracting a distance between a line representing an outline of a pad short side and a curving line representing an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; obtaining a second tentative radius by subtracting a distance between a line representing an outline of a pad short side that faces toward the pad with which the first tentative radius is calculated and an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; and averaging the same number of the first and the second tentative radii.

Abstract: A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit.

Abstract: A detecting apparatus used in a bonding apparatus including a capillary and a detection camera disposed with a certain amount of offset from the capillary and capable of detecting a press-bonded ball at a bonding portion after bonding. For a pad in which two edges of a press-bonded ball corresponding to two adjacent sides of the pad are definite, the detecting apparatus detects the respective distances between the two sides of the pad and the corresponding two edges of the press-bonded ball, and compares the detected values to determine if these values fall within previously set allowable ranges; and if the detected values are outside the allowable ranges, the amount of offset is corrected so that the press-bonded ball comes within the allowable ranges.

Abstract: A wire bonding method capable of further improving accuracy in wire bonding and realizing faster wire bonding including: transferring a semiconductor chip to a bonding center; capturing an image of a bonding point on the semiconductor chip; recognizing a position of the bonding point; performing wire bonding to the bonding point that has been corrected; capturing a post-bonding image of the semiconductor chip; transferring a next semiconductor chip to the bonding center; capturing an image of a bonding point on the next semiconductor chip; recognizing a position of the bonding point of the next semiconductor chip; and then recognizing an amount of displacement in the post-bonding image of the semiconductor chip during wire bonding to the bonding point that is of the next semiconductor chip and has been corrected.

Abstract: This invention provides a low cost fuel cell separator which reduces a contact resistance between a gas diffusion layer and the separator, has the capability of saving thickness as well as erosion resistance and mechanical strength. It is a feature of this invention that when the fuel cell separator has “chases A” 23 for transferring gas, which supplies a reaction gas to an electrode on one surface of a metal substrate 21 and “chases B” 24 for cooling, which supplies cooling media on the other surface of the metal substrate 21, at least one of the “chases A” 23 or “chases B” 24 is formed with a conductive resin 22 including a conductive filler.

Abstract: A particulate sampling apparatus configured to control the flow direction of a dispersion solvent for particulates, at a channel branching section of a channel includes an introduction channel capable of introducing the dispersion solvent, and a plurality of branch channels communicating with the introduction channel, so as to disperse desired ones of the particulates into a selected one of the branch channels, wherein the apparatus includes light irradiation means by which a bubble can be generated in the dispersion solvent by irradiation with a laser beam used as a heat source, and the flow direction of the dispersion solvent at the channel branching section is controlled by the bubble.

Abstract: A detecting apparatus used in a bonding apparatus including a capillary and a detection camera disposed with a certain amount of offset from the capillary and capable of detecting a press-bonded ball at a bonding portion after bonding. For a pad in which two edges of a press-bonded ball corresponding to two adjacent sides of the pad are definite, the detecting apparatus detects the respective distances between the two sides of the pad and the corresponding two edges of the press-bonded ball, and compares the detected values to determine if these values fall within previously set allowable ranges; and if the detected values are outside the allowable ranges, the amount of offset is corrected so that the press-bonded ball comes within the allowable ranges.

Abstract: In a cutting insert, a cutting edge is formed on a peripheral border of a rake face; a protruding section is formed on the rake face; a pair of convex sections is formed so as to extend toward the cutting edge; the convex sections face toward a corner portion; the convex sections include first wall surfaces and second wall surfaces; the first wall surfaces and the second wall surfaces are inclined surfaces that are inclined toward the rake face as those are farther from ridgelines intersecting with each other; and the intersection ridgelines intersect with a wall surface of the protruding section, at a position lower than a top portion of the protruding section in the corner portion side.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.