Abstract: The bump diameter of a bump electrode is reduced. An external connection substrate is bonded to a semiconductor chip, and is provided with, at an edge portion thereof, an external connection electrode protruding from the semiconductor chip, and continuing on both principal surfaces of the external connection substrate. The external connection electrode on a principal surface side of the external connection substrate is connected to the bump electrode through an opening in a resin layer covering the external connection electrode. The external connection electrode on the other principal surface is connected to a conductive path of a mounting board. The chip and the external connection substrate are fixed together by an underfill material. The external connection electrode and the conductive path are fixed together by solder. The bonding strength can be improved even with a reduced bump diameter so that the chip can be reduced in size.

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.