Patents by Inventor Kenji Suzuki

Kenji Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10215781
    Abstract: To provide a current sensor excellent in insulation resistance. A current sensor (1) includes a conductor (10); a support part (30) for supporting a signal processing IC (20); a magnetoelectric conversion element (13) configured to be electrically connectable to the signal processing IC (20), and arranged in a gap (10a) of the conductor (10) so as to detect a magnetic field generated by a current flowing through the conductor (10); and an insulation member (14) supporting the magnetoelectric conversion element (13).
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: February 26, 2019
    Assignee: Asahi Kasei Microdevices Corporation
    Inventors: Kenji Suzuki, Hideto Imajo, Daigo Takagi
  • Patent number: 10209516
    Abstract: An apparatus includes a user action state obtaining circuit configured to obtain an action state of a user; and a display control circuit configured to control a display to modify display information based on the action state.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: February 19, 2019
    Assignee: SONY CORPORATION
    Inventors: Kazuyuki Yamamoto, Takuro Noda, Tetsuyuki Miyawaki, Kenji Suzuki
  • Patent number: 10204462
    Abstract: A drive diagnosis device includes: a storage unit in which travel records of a moving body and past drive diagnosis results from past drive diagnoses executed for the moving body are stored; and a diagnosis processing unit that executes a drive diagnosis based upon driver's skills for driving the moving body, and personal characteristics of the driver and/or experience of the driver by using the travel records and the past drive diagnosis results stored in the storage unit.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: February 12, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Yosuke Isomura, Kenji Suzuki, Yoshifumi Izumi
  • Patent number: 10205013
    Abstract: A semiconductor switching element includes a first gate electrode and a second gate electrode. The first gate electrode is disposed, via a first gate insulating film, inside a first trench that extends from an upper surface of an emitter region to reach a semiconductor layer, and intersects with the emitter region, a base region, and a charge storage layer. The second gate electrode is disposed, via a second gate insulating film, inside a second trench that extends from the upper surface of the emitter region and an upper surface of a conductive region to reach the semiconductor layer, and is adjacent to the emitter region, the base region, the charge storage layer, and the conductive region. The second trench is smaller in depth than the first trench, and the second trench is smaller in width than the first trench.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: February 12, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mitsuru Kaneda, Tetsuo Takahashi, Kenji Suzuki, Ryu Kamibaba, Mariko Umeyama, Koichi Nishi
  • Patent number: 10196487
    Abstract: The present invention is to provide a method of producing highly pure polyarylene sulfide (PAS) while the produced amount per unit volume is enhanced and side reactions are suppressed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 5, 2019
    Assignee: KUREHA CORPORATION
    Inventors: Kenji Suzuki, Michihisa Miyahara, Hiroshi Sakabe
  • Patent number: 10190540
    Abstract: In order to stably use a catalyst for pyrolysis and supply a reformed fuel, the fuel supply system includes a fuel reforming section which pyrolyzes a hydrocarbon system fuel by the heat of the combustion chamber to generate the reformed fuel. The fuel reforming section includes a preheat vaporization section provided on the combustion chamber, and a decomposition reaction section that is provided on the preheat vaporization section and includes the catalyst for pyrolysis. The preheat vaporization section heats the fuel, the decomposition reaction section pyrolyzes the heated fuel to generate the reformed fuel, and the fuel reforming section supplies the reformed fuel to the combustion chamber. The reforming catalyst includes a zeolitic catalyst.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: January 29, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kenji Suzuki, Atsushi Kuroyanagi, Toshinobu Yasutake
  • Publication number: 20190009340
    Abstract: By melting a shaping material in which a metal powder and a binder are mixed and by carrying out injection molding (primary shaping) in an injection mold, an injection molded body, or an intermediate shaped body are produced. The injection molded body or the intermediate shaped body is placed by a transfer mold and is subjected to a gravity shaping (secondary shaping) with a transformation. A sintered body is manufactured by carrying out debindering and sintering to the injection molded body.
    Type: Application
    Filed: February 7, 2017
    Publication date: January 10, 2019
    Inventors: Kenji SUZUKI, Syuntaro TERAUCHI, Hisashi KITAGAKI, Kazuki HANAMI, Tadayuki HANADA
  • Publication number: 20190009532
    Abstract: There are provided a flow channel member, a liquid jet head, and a liquid jet device each capable of achieving thickness reduction while ensuring the effective area of a filter.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 10, 2019
    Inventors: Takanori KOYANO, Kazuyoshi TOMINAGA, Atsushi KOZUKI, Kenji SUZUKI, Masaki MIYAGI, Yuichiro HAMANO
  • Publication number: 20190009536
    Abstract: There are provided a liquid jet head and a liquid jet device capable of achieving reduction in size. There are included a first head chip and a second head chip stacked on one another in the Y direction, a first flow channel member disposed on the ?Y direction side of the first head chip, and having an inflow port communicated with an ink tank, and a first ink flow channel adapted to communicate the inflow port and the first head chip with each other, a second flow channel member disposed on the +Y direction of the second head chip, and having a second ink flow channel communicated with the second head chip, and a communication flow channel located between the first flow channel member and the second flow channel member, and adapted to communicate the first ink flow channel and the second ink flow channel with each other.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 10, 2019
    Inventors: Yuichiro HAMANO, Kazuyoshi TOMINAGA, Takanori KOYANO, Atsushi KOZUKI, Kenji SUZUKI, Masaki MIYAGI
  • Publication number: 20190009568
    Abstract: There are provided a flow channel member, a liquid jet head, and a liquid jet device which prevent generation of bubbles in an ink flow channel, and are excellent in ejection performance. There is included a first flow channel plate provided with a first ink flow channel adapted to communicate an ink tank and a first head chip with each other, the first ink flow channel includes a narrow flow channel located on an upstream side, a filtration flow channel located on a downstream side with respect to the narrow flow channel, and a connecting flow channel adapted to connect the narrow flow channel and the filtration flow channel to each other, and the connecting flow channel gradually increases in flow channel width in a direction from the upstream side toward the downstream side, and decreases in flow channel depth in the direction from the upstream side toward the downstream side.
    Type: Application
    Filed: July 6, 2018
    Publication date: January 10, 2019
    Inventors: Takanori KOYANO, Kazuyoshi TOMINAGA, Atsushi KOZUKI, Kenji SUZUKI, Masaki MIYAGI, Yuichiro HAMANO
  • Publication number: 20190013442
    Abstract: A light-emitting device mounting package includes a substrate, a frame extending upward from the substrate and surrounding a mounting portion, a lead plate supported on the frame, and a ceramic plate having a facing front surface and a facing back surface on the opposite side. The frame has a first through hole through which the lead terminal extends. The ceramic plate has a second through hole, and a metalized layer formed on the facing front surface such that the metalized layer is spaced from an opening of the second through hole. The lead plate penetrates the first and second through holes and is fixed, via a collar portion, to a region of the facing back surface around an opening of the second through hole on the facing back surface side. The insulating member is fixed to a region around the first through hole via the metalized layer.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 10, 2019
    Inventors: Masahito MORITA, Kenji SUZUKI
  • Publication number: 20190013641
    Abstract: A light-emitting device mounting package includes a substrate, a lead pin supported on the substrate, and an insulating member having a facing front surface which faces the front surface of the substrate and a facing back surface. The substrate has a first through hole and the ceramic plate has a second through hole. The lead pin has a shaft portion which penetrates the first and second through holes, a head portion provided at one end of the shaft portion, and a collar portion which extends from the shaft portion in the radial direction. The lead pin is fixed, via the collar portion, to a region of the facing back surface of the ceramic plate around an opening of the second through hole, and the ceramic plate is fixed to a region of the front surface of the substrate around an opening of the first through hole.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 10, 2019
    Inventors: Masahito MORITA, Kenji SUZUKI
  • Patent number: 10176994
    Abstract: A p-type base layer (2) is formed on a surface of an n-type silicon substrate (1). First and second n+-type buffer layers (8,9) 9 are formed on a back surface of the n-type silicon substrate (1). The first n+-type buffer layer (8) is formed by a plurality of implantations of protons at different accelerating voltages and has a plurality of peak concentrations with different depths from the back surface of the n-type silicon substrate (1). The second n+-type buffer layer (9) is formed by an implantation of a phosphorus. A position of a peak concentration of the phosphorus is shallower from the back surface of the n-type silicon substrate (1) than positions of peak concentrations of the protons. The peak concentration of the phosphorus is higher than the peak concentrations of the protons. A concentration of the protons is higher than a concentration of the phosphorus at the positions of the peak concentrations of the protons.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: January 8, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenji Suzuki, Atsushi Narazaki, Ryu Kamibaba, Yusuke Fukada, Katsumi Nakamura
  • Patent number: 10177528
    Abstract: A light-emitting device mounting package includes a substrate, a lead pin supported on the substrate, and an insulating member having a facing front surface which faces the front surface of the substrate and a facing back surface. The substrate has a first through hole and the ceramic plate has a second through hole. The lead pin has a shaft portion which penetrates the first and second through holes, a head portion provided at one end of the shaft portion, and a collar portion which extends from the shaft portion in the radial direction. The lead pin is fixed, via the collar portion, to a region of the facing back surface of the ceramic plate around an opening of the second through hole, and the ceramic plate is fixed to a region of the front surface of the substrate around an opening of the first through hole.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 8, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Masahito Morita, Kenji Suzuki
  • Publication number: 20190000722
    Abstract: The present invention provides a dental adhesive material kit excellent in storage stability of the materials and exhibiting excellent bond durability to dentin by photopolymerization. The present invention is a dental adhesive material kit comprising a dental aqueous adhesive composition (A) and a dental curable composition (B), wherein: the dental aqueous adhesive composition (A) comprises a (meth)acrylic polymerizable monomer (a) containing an acid group, a vanadium compound (b), water (c), a (meth)acrylic polymerizable monomer (d) containing an amino group, and a polymerization inhibitor (i); the content of the polymerization inhibitor (i) is 25 to 1000 parts by weight per 100 parts by weight of the vanadium compound (b); and the dental curable composition (B) comprises a (meth)acrylic polymerizable monomer (e) containing no acid group, a hydroperoxide (f), a photopolymerization initiator (g), and a filler (h) and does not comprise a thiourea compound.
    Type: Application
    Filed: December 12, 2016
    Publication date: January 3, 2019
    Applicant: KURARAY NORITAKE DENTAL INC.
    Inventor: Kenji SUZUKI
  • Patent number: 10165738
    Abstract: To reduce fatigue in the arm of an operator of a blow operation device driven by an electric motor and to realize a blow operation of blowing and gathering generated compressed air from both the right and left with a small operational burden. A blow operation device includes a backpack type frame, a battery attached to the frame, a blower body having an electric motor to which power is fed from the battery and having an axial fan driven by the electric motor, and a blower tube connected to a blow side of the blower body, the frame including a back contact surface, and the blower body being attached to the frame such that axial directions of the electric motor and the axial fan are along the back contact surface.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: January 1, 2019
    Assignee: Yamabiko Corporation
    Inventors: Kunihiko Haramoto, Kenji Suzuki
  • Publication number: 20180366566
    Abstract: An object of the present invention is to provide a semiconductor device capable of preventing an occurrence of oscillation of voltage and current and a method of manufacturing the same. A semiconductor device according to the present invention includes an n type silicon substrate and a first n type buffer layer formed in a back surface of the n type silicon substrate and having a plurality of peaks of concentration of protons whose depths from the back surface are different from each other. In the first n type buffer layer, a concentration gradient of the protons from the peak located in a position closer to the back surface toward the surface of the n type silicon substrate is smaller than a concentration gradient of the protons from the peak located in a position farther away from the back surface toward the surface.
    Type: Application
    Filed: February 16, 2018
    Publication date: December 20, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kenji SUZUKI, Mitsuru KANEDA, Koichi NISHI, Katsumi NAKAMURA
  • Patent number: 10158744
    Abstract: A terminal device includes a support component including first and second support parts that are laterally symmetrically arranged with respect to a center axis and each locks a strap; and a case including a first wall part, a second wall part provided continuous with the first wall part at one end portion of the first wall part and a third wall part provided continuous with the first wall part at the other end portion of the first wall part, each of the first, second and third wall parts including respective opening parts through which the strap pass, wherein the support component is mounted to each of a first corner part formed with the first and second wall parts and a second corner part formed with the first and third wall parts, and at least one of the first and second support parts is exposed from each of the opening parts.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: December 18, 2018
    Inventors: Kenji Suzuki, Yasufumi Yamamoto, Yoshiyuki Sando
  • Patent number: 10156362
    Abstract: A fuel supply system includes a fuel reformer in contact with at least one of a combustion chamber or a wall of the combustion chamber. The fuel reformer includes a reformer chamber wall enclosing a fuel reformer chamber, and a reforming catalyst support sheet in the fuel reformer chamber.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: December 18, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventor: Kenji Suzuki
  • Patent number: 10150630
    Abstract: A post-processing apparatus includes a side edge part removing portion that removes a side edge part from a sheet; a side edge part housing portion that houses the removed side edge part and is able to be pulled out from an apparatus body; a guide plate that is inclined in a direction intersecting with a moving direction of the side edge part and guides the removed side edge part along the moving direction to the housing portion; and a second guide plate that is arranged between the housing portion and the guide plate, and is transformable into a first form having substantially mountain-shaped inclined surfaces in which both end portions of the second guide plate along the moving direction are lower than a center portion thereof, and a second form having substantially valley-shaped inclined surfaces in which both the end portions are higher than the center portion.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: December 11, 2018
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Akira Sakuma, Shinji Masaki, Kenji Suzuki, Katsushi Amarume, Takeshi Ichikawa