Abstract: The present invention relates to an active oxygen scavenging agent and a cancer chemopreventing agent both comprising a dried Grifola, a dry Grifola powder and/or a Grifola extract, and to a food or animal feed comprising the active oxygen scavenging agent or the cancer chemopreventing agent.

Abstract: The present invention relates to an active oxygen scavenging agent and a cancer chemopreventing agent both comprising a dried Grifola, a dry Grifola powder and/or a Grifola extract, and to a food or animal feed comprising the active oxygen scavenging agent or the cancer chemopreventing agent.

Abstract: A photopolymerizable composition comprising (A) a polymer binder, (B) a photopolymerizable monomer and (C) a photopolymerization initiator, wherein the component (B) is at least one compound represented by the following formula (1):

Abstract: A photopolymerizable composition comprising (A) a polymer binder, (B) a photopolymerizable monomer and (C) a photopolymerization initiator, wherein the component (B) is at least one compound represented by the following formula (1): 1

Abstract: An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

Abstract: The present invention relates to an active oxygen scavenging agent and a cancer chemopreventing agent both comprising a dried Grifola, a dry Grifola powder and/or a Grifola extract, and to a food or animal feed comprising the active oxygen scavenging agent or the cancer chemopreventing agent.

Abstract: An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

Abstract: The remover solution of the invention comprises (A) from 35 to 80% by weight of an alcoholic solvent such as ethylene glycol monoethyl ether, (B) from 10 to 40% by weight of an organic solvent which is a halogenated hydrocarbon solvent, e.g., 1,2-dichlorobenzene and methylene chloride, an ether solvent, e.g., tetrahydrofuran, or an aromatic solvent, e.g., benzene and xylene, and (C) from 0.1 to 25% by weight of a quaternay ammonium compound such as tetramethyl ammonium hydroxide and trimethyl hydroxyethyl ammonium hydroxide. Different from conventional remover solutions which only can swell cured photoresist compositions, the inventive remover solution has a power to completely dissolve a cured photoresist layer to give a quite satisfactory result in the removing works of patterned photoresist layers in the manufacture of semiconductor devices.

Abstract: The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.

Abstract: The photosensitive resin composition comprises (a) a ternary copolymer of an ethylenically unsaturated amide, carboxyl-containing monomer and third monomer, (b) an esterified resin by the reaction of an unsaturated carboxylic acid and a novolactype epoxy resin, (c) a photopolymerizable monomer, (d) a photopolymerization initiator and (e) a powder such as a finely divided silica filler. The resist layer formed from the composition is capable of being developed with an alkaline aqueous solution and has excellent heat resistance in addition to other desirable properties when the patterned resist layer by the pattern-wise exposure to ultraviolet light and development is subjected to a heat treatment to effect thermal curing.

Abstract: The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.