Patents by Inventor Kenji TOMOKIYO

Kenji TOMOKIYO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TUNGSTEN WIRE, AND TUNGSTEN WIRE PROCESSING METHOD AND ELECTROLYTIC WIRE USING THE SAME
    Publication number: 20240052461
    Abstract: According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hitoshi AOYAMA, Hideaki BABA, Masanori MIZOBE, Kenji TOMOKIYO
  • RHENIUM-TUNGSTEN WIRE ROD AND THERMOCOUPLE USING THE SAME
    Publication number: 20230413672
    Abstract: The rhenium tungsten wire rod according to an embodiment is a wire rod made of a tungsten alloy containing rhenium, wherein a rhenium content is less than 30 wt % in any measurement area of a wire rod body where a unit area is 1 ?m in diameter.
    Type: Application
    Filed: September 6, 2023
    Publication date: December 21, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hitoshi AOYAMA, Hideaki BABA, Kenji TOMOKIYO
  • TUNGSTEN WIRE, TUNGSTEN WIRE PROCESSING METHOD USING THE SAME, AND ELECTROLYZED WIRE
    Publication number: 20230366069
    Abstract: A tungsten wire according to an embodiment is a tungsten wire made of a W alloy containing rhenium, and includes a mixture on at least a part of a surface thereof, the mixture contains W, C, and O as constituent elements, and taking a radial cross-sectional thickness of the mixture as A mm and a diameter of the tungsten wire as B mm, an average value of a ratio A/B of A to B is 0.3% to 0.8%.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 16, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hitoshi AOYAMA, Hideaki BABA, Kenji TOMOKIYO