Patents by Inventor Kenji Toyozawa

Kenji Toyozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method
    Patent number: 4993618
    Abstract: A wire bonding method for connecting a pad of a semiconductor chip and an inner lead with a bonding wire, which comprises the steps of pressing a ball formed on an end of the bonding wire to the pad, and applying ultrasonic waves to the ball, while the output of the ultrasonic waves is reduced after a predetermined period of time from the beginning of the step of pressing.
    Type: Grant
    Filed: July 27, 1989
    Date of Patent: February 19, 1991
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kenji Toyozawa, Takamichi Maeda