Patents by Inventor Kenji Utida

Kenji Utida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component
    Patent number: 6011303
    Abstract: An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: January 4, 2000
    Assignee: NEC Corporation
    Inventors: Junichi Tanaka, Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Kenji Watanabe, Kenji Utida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota