Patents by Inventor Kenji Wakiguchi

Kenji Wakiguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing low-oxygen copper
    Patent number: 7524356
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: April 28, 2009
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Method for manufacturing low-oxygen copper
    Publication number: 20050262968
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Application
    Filed: August 2, 2005
    Publication date: December 1, 2005
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Method for manufacturing low-oxygen copper
    Patent number: 6944930
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: September 20, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Apparatus for manufacturing low-oxygen copper
    Patent number: 6589473
    Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: July 8, 2003
    Assignee: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Method for manufacturing low-oxygen copper
    Publication number: 20010029659
    Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.
    Type: Application
    Filed: February 26, 2001
    Publication date: October 18, 2001
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
  • Apparatus for manufacturing low-oxygen copper
    Publication number: 20010028135
    Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a soaking furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the soaking furnace in a non-oxidizing atmosphere and for transferring the molten copper to a turn-dish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the turn-dish, and a cutter for cuffing the cast copper into a predetermined length.
    Type: Application
    Filed: February 22, 2001
    Publication date: October 11, 2001
    Applicant: Mitsubishi Materials Corporation
    Inventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori