Patents by Inventor Kenji Yamauchi

Kenji Yamauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230167214
    Abstract: The present invention provides a resin composition for sintering, an inorganic fine particle-dispersed slurry composition containing the resin composition for sintering, and an inorganic fine particle-dispersed sheet formed using the resin composition for sintering or inorganic fine particle-dispersed slurry composition. The present invention relates to a resin composition for sintering, containing a binder resin, the binder resin including a (meth)acrylic resin (A), the (meth)acrylic resin (A) having at least one selected from the group consisting of a sulfone group, an alkyl sulfonyl group, an aromatic sulfonyl group, a sulfine group, an imidazoline group, a carboxy group, an amide group, an amino group, and a hydroxy group at at least one molecular end of the main chain and having a weight average molecular weight (Mw) of 1,000,000 or more, an amount of a water-soluble surfactant in the resin composition for sintering being 0 parts by weight or more and 0.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 1, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kenji YAMAUCHI, Takeshi WAKIYA, Tatsuya MATSUKUBO, Kanako TAMAGAWA, Jo OTSUKA, Yumi KANEKO
  • Patent number: 11649308
    Abstract: A resin composition which has excellent decomposability at low temperature, can provide a molded article having high strength, and enables an increase in the number of layers and thinning so as to enable production of an all-solid-state battery and a ceramic laminate having excellent properties. An inorganic fine particle-dispersed slurry composition containing the resin composition, an inorganic fine particle-dispersed sheet, a method for producing an all-solid-state battery, and a method for producing a multilayer ceramic capacitor. A resin composition containing a (meth)acrylic resin, the (meth)acrylic resin containing 20 to 70% by weight in total of a segment derived from methyl methacrylate and a segment derived from isobutyl methacrylate, 1 to 10% by weight of a segment derived from a glycidyl group-containing (meth)acrylate, and 5 to 40% by weight of a segment derived from a (meth)acrylate containing an ester substituent having a carbon number of 8 or more.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: May 16, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kenji Yamauchi, Tatsuya Matsukubo, Shinya Nakano, Jo Otsuka
  • Publication number: 20210317296
    Abstract: The present invention aims to provide a vehicle composition for inorganic fine particle dispersion which has excellent decomposability at low temperature and enables degreasing in a short time, an inorganic fine particle-dispersed slurry composition containing the vehicle composition for inorganic fine particle dispersion, and a method for producing an inorganic fine particle-dispersed sheet with the inorganic fine particle-dispersed slurry composition. The present invention relates to a vehicle composition for inorganic fine particle dispersion, containing a binder resin, an organic solvent, and an organic compound having a boiling point at normal pressure of 200° C. or higher and lower than 400° C.
    Type: Application
    Filed: August 21, 2019
    Publication date: October 14, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Jo OTSUKA, Tatsuya MATSUKUBO, Kenji YAMAUCHI, Yasuko ISHIDA
  • Patent number: 10968373
    Abstract: The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: April 6, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Shiori Tateno, Takayuki Maeda, Kenji Yamauchi
  • Patent number: 10711128
    Abstract: The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 14, 2020
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Takayuki Maeda, Kenji Yamauchi, Shiori Tateno
  • Publication number: 20200199345
    Abstract: The present invention provides a resin composition which has excellent decomposability at low temperature, can provide a molded article having high strength, and enables an increase in the number of layers and thinning so as to enable production of an all-solid-state battery and a ceramic laminate (e.g., a multilayer ceramic capacitor) having excellent properties. The present invention also relates to an inorganic fine particle-dispersed slurry composition containing the resin composition, an inorganic fine particle-dispersed sheet, a method for producing an all-solid-state battery, and a method for producing a multilayer ceramic capacitor.
    Type: Application
    Filed: June 21, 2018
    Publication date: June 25, 2020
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kenji YAMAUCHI, Tatsuya MATSUKUBO, Shinya NAKANO, Jo OTSUKA
  • Publication number: 20190276718
    Abstract: The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.
    Type: Application
    Filed: September 26, 2017
    Publication date: September 12, 2019
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Shiori TATENO, Takayuki MAEDA, Kenji YAMAUCHI
  • Publication number: 20180369982
    Abstract: A grinding device has a support unit attached to a rotary shaft so as to be rotatable integrally with the rotary shaft, and a grinding element stacked on the support unit and having an uneven grinding surface formed by a plurality of abrasive grains. The support unit has, in a surface thereof, protruding surface portions to be brought into contact with a rear surface of the grinding element when in use, and recessed surface portions recessed from the protruding surface portions, alternately located in a circumferential direction. An engagement mechanism which makes an engagement at each of predetermined angular positions so as to retain the grinding element or the support unit moved by a predetermined angle in the circumferential direction, is provided between the support unit and the grinding element, between the rotary shaft and the grinding element, or between the rotary shaft and the support unit.
    Type: Application
    Filed: September 2, 2016
    Publication date: December 27, 2018
    Applicant: NEW REGISTON CO., LTD.
    Inventors: Kenji Yamauchi, Tatsuo Kitatani, Daisuke Takita
  • Publication number: 20180194935
    Abstract: The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.
    Type: Application
    Filed: September 30, 2016
    Publication date: July 12, 2018
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Takayuki MAEDA, Kenji YAMAUCHI, Shiori TATENO
  • Patent number: 10003069
    Abstract: A lead-acid battery includes a negative electrode material containing graphite and barium sulfate. A ratio S/W of an average plate interval S between a negative electrode plate and a positive electrode plate, to a mass W of the negative electrode material per one negative electrode plate is 0.01 mm/g or more.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: June 19, 2018
    Assignee: GS Yuasa International Ltd.
    Inventors: Kenji Yamauchi, Masaaki Kyo, Satoshi Inagaki
  • Patent number: 9951154
    Abstract: A polyvinyl acetal resin for a heat-developable photosensitive material capable of preventing skinning in the coating process of the photosensitive layer of the heat-developable photosensitive material, preventing deterioration of image characteristics and coloration of the coating solution, and suppressing the occurrence of odor at the time of producing the heat-developable photosensitive material and heat development. The polyvinyl acetal resin for a heat-developable photosensitive material used for a photosensitive layer of the heat-developable photosensitive material has a residual acetyl group content of 25 mol % or less, residual hydroxyl group content of 17-35 mol %, and polymerization degree of 200 to 3,000, and is obtained by an acetalization of a polyvinyl alcohol mixture containing polyvinyl alcohol resins having different polymerization degrees, wherein the content of the polyvinyl alcohol having a polymerization degree of 600 or less is 50 wt % or higher in the polyvinyl alcohol mixture.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: April 24, 2018
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kenji Yamauchi, Jiro Miyai, Shogo Naruwaki, Takayuki Maeda
  • Patent number: 9813820
    Abstract: A loudspeaker includes a light-emitting element, a frame, a magnetic circuit provided with a magnetic gap, a diaphragm, a voice coil bobbin, and a voice coil. The diaphragm has an inner circumferential end including an end face facing the light-emitting element, and a light guide having a reflecting surface formed thereon and provided at a position where light enters from the end face. The first end of the voice coil bobbin is joined to the inner circumferential end of the diaphragm, and the second end is inserted into the magnetic gap. The voice coil is wound around the second end of the voice coil bobbin. Light from the light-emitting element enters the end face of the diaphragm, is diffused by the light guide, and is reflected on the reflecting surface.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: November 7, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takafumi Yuasa, Kenji Yamauchi, Satoshi Takayama, Koichi Nakayama, Ryo Kuribayashi
  • Patent number: 9796866
    Abstract: The present invention provides a conductive paste that has excellent printability, that can provide a printed electrode with a smooth surface, and that is excellent in storage stability. The present invention relates to a conductive paste used for formation of an electrode of a multilayer ceramic capacitor, the conductive paste including: a polyvinyl acetal resin that contains a carboxylic acid-modified polyvinyl acetal resin; an organic solvent; and a conductive powder, the polyvinyl acetal resin having an average degree of polymerization of 200 to 800, an carboxyl group content of 0.05 to 1 mol %, a hydroxy group content of 16 to 24 mol %, an acetyl group content of 0.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: October 24, 2017
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Hiroko Kobayashi, Kenji Yamauchi, Shintaro Moriguchi, Jiro Miyai
  • Patent number: D819109
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kenji Yamauchi, Kyunghan Noh, Minki Ham
  • Patent number: D869452
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: December 10, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kuk-Hwan Kim, Kenji Yamauchi, Yong-Sang Jang, Seung-Ho Jung, Woo-Hyeok Jeong, Tae-Joong Kim, Ji-Young Lee
  • Patent number: D986239
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insik Chung, Juan Lee, Kenji Yamauchi
  • Patent number: D995515
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insik Chung, Juan Lee, Kenji Yamauchi
  • Patent number: D1003293
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insik Chung, Juan Lee, Kenji Yamauchi
  • Patent number: D1006014
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insik Chung, Juan Lee, Kenji Yamauchi
  • Patent number: D1008258
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Insik Chung, Juan Lee, Kenji Yamauchi