Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Abstract: A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Abstract: A pad structure for a circuit board including a phosphorus-containing nickel layer is provided, capable of improving a tensile strength of a solder member such as a solder ball mounted thereon or a foreign member soldered thereto. The pad structure (40) is a multi-layer plated structure provided in a conductor pattern of the substrate, for mounting the solder bump (20) thereon, and formed as part of the conductor pattern, including a metal layer (10) formed as part of the conductor pattern to constitute a pad body, a phosphorus-containing nickel layer (12) formed by an electroless nickel plating to be directly brought into contact with the metal layer, a copper layer (14) thinner than the nickel layer, formed on the nickel layer by an electroless copper plating, and a precious metal layer (16) formed on the copper layer by an electroless precious metal plating.