Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: A laminated ceramic electronic component includes curved surface portions provided in an outer surface of a ceramic element assembly, and internal conductors provided within the ceramic element assembly that are exposed in the curved surface portions and principal surfaces to define starting points for plating deposition. A base layer, in an external conductor, which is defined by a plating film is arranged so as to directly cover the exposed portions of the internal conductors.

Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: A laminated ceramic electronic component includes curved surface portions provided in an outer surface of a ceramic element assembly, and internal conductors provided within the ceramic element assembly that are exposed in the curved surface portions and principal surfaces to define starting points for plating deposition. A base layer, in an external conductor, which is defined by a plating film is arranged so as to directly cover the exposed portions of the internal conductors.

Abstract: In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges.

Abstract: A noise filter array includes filter elements including an LC parallel resonant circuit and an LC series resonant circuit each of which includes a coil and a capacitor provided in proximity in an array and integrally provided with one another. The LC series resonant circuits include ground capacitors having signal-side electrodes. Inductance adjustment conductors are connected to signal-side electrodes of the capacitors defining the respective filter elements, and a ground electrode of the capacitors is commonly arranged so as to oppose the signal-side electrodes.

Abstract: A noise filter array includes filter elements, each of which includes an LC parallel resonant circuit having a coil and a capacitor and an LC series resonant circuit having a coil and a capacitor, are arranged substantially parallel to one another in an array and integrally provided. Grounding capacitors that define the filter elements are arranged so that a common ground-side electrode faces signal-side electrodes and is connected to an inductance adjusting conductor that defines the LC series resonant circuits along with the capacitors through a via hole. The lengths of the inductance adjusting conductor from a connection location within the via hole to ground terminals are substantially equal in each of the filter elements.

Abstract: A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.

Abstract: In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thickness. In order to form the terminal electrode, the resistor film is disposed directly on the surface of the component body, and a conductive resin film having a relatively low volume resistivity is disposed over the resistor film. The conductive resin film is preferably adapted to have a specific resistance of less than about 1×10?4 ?·m, on which a plating film having a uniform film thickness can be formed efficiently via electroplating.

Abstract: A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.

Abstract: A noise filter array includes filter elements including an LC parallel resonant circuit and an LC series resonant circuit each of which includes a coil and a capacitor provided in proximity in an array and integrally provided with one another. The LC series resonant circuits include ground capacitors having signal-side electrodes. Inductance adjustment conductors are connected to signal-side electrodes of the capacitors defining the respective filter elements, and a ground electrode of the capacitors is commonly arranged so as to oppose the signal-side electrodes.

Abstract: A noise filter array includes filter elements, each of which includes an LC parallel resonant circuit having a coil and a capacitor and an LC series resonant circuit having a coil and a capacitor, are arranged substantially parallel to one another in an array and integrally provided. Grounding capacitors that define the filter elements are arranged so that a common ground-side electrode faces signal-side electrodes and is connected to an inductance adjusting conductor that defines the LC series resonant circuits along with the capacitors through a via hole. The lengths of the inductance adjusting conductor from a connection location within the via hole to ground terminals are substantially equal in each of the filter elements.

Abstract: In a monolithic electronic component in which a resistive element is incorporated by forming a resistor film on a terminal electrode, a plating film can be formed on the terminal electrode having the resistor film via electroplating in an efficient manner and with a uniform film thickness. In order to form the terminal electrode, the resistor film is disposed directly on the surface of the component body, and a conductive resin film having a relatively low volume resistivity is disposed over the resistor film. The conductive resin film is preferably adapted to have a specific resistance of less than about 1×10?4 ?·m, on which a plating film having a uniform film thickness can be formed efficiently via electroplating.

Abstract: A monolithic varistor includes a sintered layered body and a pair of external electrodes disposed on opposite ends of the layered body. The layered body is composed of a plurality of varistor sheets and a plurality of valistor electrodes, which are layered on one another and integrally fired. T is defined as the distance between the varistor electrodes, and Ty is defined as the distance between an outermost varistor electrode and the upper surface of the sintered layered body. Further, Tx is defined as the distance between the external electrodes and the corresponding edges of the varistor electrodes. The varistor is designed in order to satisfy one of the following three conditions: Condition (A) 1.5≦(Tx/T)≦3.0 Condition (B) (Ty/T)≧1.0 Condition (C) 1.5≦(Tx/T)≦3.0 and (Ty/T)≧1.

Abstract: A laminated-type varistor includes a laminated structure and a pair of external electrodes disposed on a surface of the laminated structure. The laminated structure includes effective sintered body layers and internal electrodes. The internal electrodes are connected to the external electrodes and are disposed apart from each other in the direction perpendicular to lamination surfaces. Each of the internal electrodes has a multilayer electrode structure in which a plurality of electrode layers are arranged in layers while an ineffective sintered body layer is disposed therebetween. The laminated-type varistor has increased maximum peak current and maximum energy and reduction in clamping voltage.