Abstract: A multilayer three-dimensional circuit substrate includes a first substrate, a first protective metal layer, a second protective metal layer, a second substrate, a first interlayer connecting member, and a second interlayer connecting member. The first protective metal layer has a lower absorption rate of light than a first wiring provided on a first surface of the first substrate. The second protective metal layer has a lower absorption rate of light than a second wiring provided on a second surface of the first substrate. The second substrate is configured such that a thickness between a fifth surface and a sixth surface is thinner than a thickness between a third surface and a fourth surface. A sensor is provided on the fifth surface.

Abstract: A wiring board has a first principal surface including one or more first pads configured to bond an electronic component, one or more second pads configured not to bond another member, one or more wiring patterns connecting the one or more first pads to the one or more second pads, respectively, and a solder nonwetting region is formed on each of the one or more second pads.

Abstract: A distal end unit for endoscope is provided in a distal end portion of an insertion portion and includes: an electronic module including an optical system and an electrode; a substrate including a connection portion electrically connected to the electrode of the electronic module, and including a connection land on which an electronic component is mounted; a holding member holding the electronic module and the substrate connected to the electrode; and a distal end frame body made of resin, on which the electronic module, the substrate and the holding member are integrally mounted via insert molding by loading the holding member holding the electronic module and the substrate in a mold such that an entrance surface of the optical system is exposed at an outer surface of the distal end frame body and the connection portion extends to a proximal end side.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: An endoscope includes an imager unit loading region provided at a distal end portion of an insertion portion, a cable connection surface, a wall provided to connect an opening of the imager unit loading region and an opening of the cable connection surface to each other, a contact pattern formed on a wall surface of the imager unit loading region, a wiring pattern formed on a front surface of the cable connection surface from the wall, a connection pattern formed on the cable connection surface, and a through-electrode formed in the wall so that the imager unit loading region and the cable connection surface communicate with each other, configured to cause the contact pattern and the wiring pattern to electrically continue to each other, and formed at a predetermined angle with respect to a center axis of the distal end barrel member.

Abstract: A distal end unit for endoscope is provided in a distal end portion of an insertion portion and includes: an electronic module including an optical system and an electrode; a substrate including a connection portion electrically connected to the electrode of the electronic module, and including a connection land on which an electronic component is mounted; a holding member holding the electronic module and the substrate connected to the electrode; and a distal end frame body made of resin, on which the electronic module, the substrate and the holding member are integrally mounted via insert molding by loading the holding member holding the electronic module and the substrate in a mold such that an entrance surface of the optical system is exposed at an outer surface of the distal end frame body and the connection portion extends to a proximal end side.

Abstract: A surgical instrument includes: a handpiece; a movable member configured to transmit a driving force to a treating member to treat a subject by moving relatively to the handpiece; and a connector arranged inside the handpiece, and including a strip to apply a pressing force to the movable member. The movable member includes a first conductive portion formed therein. The connector includes a second conductive portion formed on the strip. The second conductive portion abutting against the first conductive portion to connect the movable member and the handpiece electrically. The second conductive portion of the connector is a molded interconnect device constituting a three-dimensional circuit.

Abstract: A surgical instrument includes: a handpiece; a movable member configured to transmit a driving force to a treating member to treat a subject by moving relatively to the handpiece; and a connector arranged inside the handpiece, and including a strip to apply a pressing force to the movable member. The movable member includes a first conductive portion formed therein. The connector includes a second conductive portion formed on the strip. The second conductive portion abutting against the first conductive portion to connect the movable member and the handpiece electrically. The second conductive portion of the connector is a molded interconnect device constituting a three-dimensional circuit.

Abstract: A printed circuit board connection structure is formed by clamping and connecting a first printed circuit board and a second printed circuit board, at least one of which is a flexible printed circuit board, with a conductive adhesion layer therebetween, and includes first marks formed on the first printed circuit board and second marks and formed on the second printed circuit board. The area enclosed by the perimeter of one set of marks out of the first marks and the second marks is greater than the area enclosed by the perimeter of the other set of marks, and with the printed circuit boards in an allowable state of connection, at least a portion of the region enclosed by the perimeter of the other set of marks is located within the region enclosed by the perimeter of the one set of marks when viewed in a direction of stacking of the printed circuit boards.