Abstract: Channel members 100 to 107 according to the present invention have an inner spiral channel 9 through which a fluid 23 flows. The channel 9 is formed by a lid part 1, a bottom plate part 3, and a wall part 2 connected to the lid part 1 and the bottom plate part 3. The wall part 2 is made of a ceramic laminate. Even if the wall part 2 of the channel members 100 to 107 is narrow between channel segments 9, its good corrosion resistance allows the channel 9 to be resistant to collapse when the fluid 23 is supplied at high pressure. A heat exchanger 200, a semiconductor unit 300, and a semiconductor manufacturing apparatus 400 including any of the channel members 100 to 107 have improved heat exchange efficiency between the channel members 100 to 107 and the fluid 23.

Abstract: Channel members 100 to 107 according to the present invention have an inner spiral channel 9 through which a fluid 23 flows. The channel 9 is formed by a lid part 1, a bottom plate part 3, and a wall part 2 connected to the lid part 1 and the bottom plate part 3. The wall part 2 is made of a ceramic laminate. Even if the wall part 2 of the channel members 100 to 107 is narrow between channel segments 9, its good corrosion resistance allows the channel 9 to be resistant to collapse when the fluid 23 is supplied at high pressure. A heat exchanger 200, a semiconductor unit 300, and a semiconductor manufacturing apparatus 400 including any of the channel members 100 to 107 have improved heat exchange efficiency between the channel members 100 to 107 and the fluid 23.

Abstract: There is provided a flow channel member which is configured by laminating a plurality of side wall units and inside which a flow channel is provided, wherein occurrence of joint failure of the side wall units are reduced. A flow channel member includes a cover unit, a side wall unit, and a bottom plate unit, wherein a flow channel through which a fluid flows is provided inside the flow channel member, and a gap which communicates with the flow channel is provided between the cover unit and the side wall unit. According to the flow channel member, since the gap which communicates with the flow channel is located between the cover unit and the side wall unit, a contact area between the flow channel and the fluid increases, and thus heat exchange efficiency with the cover unit may be increased.